The X-FAB mixed signal foundry announced availability of 16 new process options for its 0.6micron CMOS process family. These processes can be combined in a modular fashion to fit specific application needs.
The austriamicrosystems foundry has extended its design environment support based on the Mentor Graphics IC design flow. This includes high-performance design kits (HIT-Kits) for analogue/mixed-signal (AMS) and radio frequency (RF) designs on austriamicroysystems 0.35micron CMOS and BiCMOS process technologies.
E Ink Corporation and Philips Electronics have jointly developed prototype electronic ink displays. Engineering samples have been produced for a lead customer. The display features a resolution at 160 pixels per inch (ppi).
Microsystem producer PHS MEMS announced the availability of custom micro-electro-mechanical system (MEMS) based integrated passive devices (IPDs) and advanced processes to use within RF modules for wireless hand-held equipment and for other mobile applications.
The Institute of Semiconductor Chinese Academy of Science (ISCAS) in Beijing has expanded its R&D capability by installing an R&D Closed Coupled Showerhead (CCS) MOCVD reactor provided by Thomas Swan Scientific Equipment (TSSE).
Toshiba Matsushita Display Technology (TMD) has developed a new "input display" technology that is able to capture images directly via sensors within a thin film transistor (TFT) liquid crystal display (LCD).
TRONICS Microsystems is extending its custom micro-electro-mechanical
systems (MEMS) production facilities in Crolles, France. The company will
insert a new cleanroom into an existing facility with work to be completed
by July and full volume production by year-end.
Nanotechnology consulting company Científica has expanded its business with the opening of new offices in London, UK, New York, USA, and Mumbai, India. The information and consulting business will relocate to London. New York and London are the cities where many of the commercial decisions concerning the future of nanotechnology will be taken.
Dutch researcher Michiel Blauw of the Delft Institute of Microelectronics and Submicrotechnology (DIMES) gained his PhD on January 19, 2004, for work on improved fluorine-based plasma etch of deep, narrow microstructures in silicon. Blauw studied how the plasma reacts with the silicon and how the sidewalls must be treated so as to make the trench as deep and as straight as possible.
IC test equipment company Advantest plans to develop a fast, accurate
failure diagnostics solution for deep-submicron, high-speed system-on-chip
(SoC) designs using TetraMAX automatic test pattern generation (ATPG)
technology from electronic design automation (EDA) tool provider Synopsys.
The tool under development will use data communication between the company's
T6000 series ATE system and Synopsys' TetraMAX ATPG tool to streamline the
process of detecting failures.
Fujitsu Laboratories has developed a technique for vertical growth and
diameter control of multi-wall carbon nanotubes on a silicide layer for
constructing MOSFET electrodes (gate, drain, and source). Deposition was by
plasma-enhanced CVD. An electric field perpendicular to the wafer surface
induced nanotube growth aligned with the field. Varying the nickel and
cobalt content of the silicide controls the tube diameters. The company says
the technique is