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Friday 26th January 2007
Semiconductor lithography market finally reaches new record
Friday 26th January 2007
IBM and Ricoh to create joint venture printing systems company
Friday 26th January 2007
SEMATECH & TEL partner in 3D interconnect & high-mobility channel materials
Friday 26th January 2007
Management Dynamics expands Asia Pacific operations
Friday 26th January 2007
Mayfield fund raises dedicated $200 million China fund
Wednesday 24th January 2007
TI reports profits increase but reduces workforce
Wednesday 24th January 2007
MEMS devices make major game players for consumer integration
Wednesday 24th January 2007
Silicon Valley solar secures agreement with German photovoltaic manufacturer
Wednesday 24th January 2007
Agreement signed to commercialize image sensors for wafer-level CSP
Wednesday 24th January 2007
PMC-Sierra expands China operations with opening of new Shanghai office
Wednesday 24th January 2007
New partnership signals demand in Japanese market for analogue design software
Tuesday 23rd January 2007
Sun and Intel announce landmark agreement
Tuesday 23rd January 2007
Renesas Technology and Key Stream to collaborate on wireless LAN solutions
Tuesday 23rd January 2007
Collaboration announced to promote real-time data systems for Chinese market
Tuesday 23rd January 2007
Blaze DFM qualified by STARC for 65nm leakage power optimization
Tuesday 23rd January 2007
Veeco AFM patent affirmed in European patent opposition
Monday 22nd January 2007
Berkeley Design Automation opens subsidiary in Japan
Monday 22nd January 2007
Blaze DFM opens San Diego development and support centre
Monday 22nd January 2007
Hoku and SANYO enter major polysilicon supply contract
Monday 22nd January 2007
ONFI accelerates time-to-market for NAND-based products
Friday 19th January 2007
SoftJin establishes off-shore development centre in India
Friday 19th January 2007
Cabot Microelectronics and DuPont Air Products in patent infringement dispute
Friday 19th January 2007
Praxair to supply New SMIC wafer plant in Shanghai
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