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Monday 28th April 2014
Electronic components made up of a layer of molybdenite superposed on a layer of silicon can produce light due to the the special properties of molybdenite
Friday 25th April 2014
The 14 nm FPGA test chips confirm the performance, power and density advantage Altera receives using one of the industry’s most advanced process technologies
Thursday 24th April 2014
Researchers are trying to maximise the collisions between photons and electrons in the thinnest possible layers of photovoltaic material 
Thursday 24th April 2014
The strategic collaboration is aimed at enabling the firms to share technology and allow global capacity for 14nm FinFET fabrication in the U.S. and Korea
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Thursday 24th April 2014
O-Film will be entitled to Tessera's MEMS IP license, Fotonation repaid royalties, equipment sales and sale of selected non-core patents
Wednesday 23rd April 2014
EV Group is leading, Applied Materials and Tokyo Electron are merging. What will happen next Yole asks?
Wednesday 23rd April 2014
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Wednesday 16th April 2014
Suited to 200 and 300mm wafers, the tool is claimed to use fewer chemicals, shorten process times and enable high wafer-to-wafer consistency
Tuesday 15th April 2014
The merger of Diamond Innovations and Sandvik Hard Materials intends to broaden materials solutions and increase R&D and application developments
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Tuesday 15th April 2014
Drivers in this market are sizes of less than 45 nm and increased manufacturing in the Asia-Pacific region, with Taiwan being the most dominant
Monday 14th April 2014
This sector has been invigorated by resurgent activity. In 2013 the top five spenders were the U.S., China, Japan, Germany and France
Monday 14th April 2014
Solid-state chemistry and theoretical physics combined have helped scientists to discover that europium titanium oxide, when stretched, could be used for data storage
Monday 14th April 2014
The firm's thin film chips incorporate a moisture-resistant tantalum nitride film. They are designed for use in low-noise, high-precision control systems for military, aerospace, telecommunications, and industrial applications

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