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Tuesday 27th May 2014
The device, which performs video format conversion, supports high-resolution, real-time monitor displays like head-mounted products
Tuesday 27th May 2014
A weak Japanese yen has slashed the overall dollar sales growth in 2013 in these markets
Tuesday 27th May 2014
The momentum was driven by mainly memory, foundry, and back-end spending
Tuesday 27th May 2014
The thermal interface standard will facilitate integration into multi-vendor EDA tool flows used in the design of either 2D die or 3D-ICs
Tuesday 27th May 2014
The mutual decision sees CFO Wolfgang Breme leaving the group
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Tuesday 27th May 2014
The wafers will be used for the RF and power semiconductor markets
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Monday 19th May 2014
Foundry and license agreement ensures multi-source availability of 28nm FD-SOI technology for faster, cooler and simpler semiconductor devices
Thursday 15th May 2014
Technologists Achieve High Resist Sensitivity Targets, Potentially Easing EUV Source Power Requirements
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Wednesday 14th May 2014
Toshiba and SanDisk Sign Memorandum of Understanding 
Monday 12th May 2014
Technologists at SEMATECH Successfully Reduce Defects from Multi-layer Deposition of Mask Blanks, Meeting the Defect Requirements for Early Introduction of EUV
Friday 9th May 2014
The orders were secured by several major aerospace and defence customers
Friday 9th May 2014
Friday 9th May 2014
The film combines high glass transition temperature and stress absorption with thermal performance in die‐attach power dissipation

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