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Tuesday 27th May 2014
The mutual decision sees CFO Wolfgang Breme leaving the group
Tuesday 27th May 2014
The wafers will be used for the RF and power semiconductor markets
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Monday 19th May 2014
Foundry and license agreement ensures multi-source availability of 28nm FD-SOI technology for faster, cooler and simpler semiconductor devices
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Thursday 15th May 2014
Technologists Achieve High Resist Sensitivity Targets, Potentially Easing EUV Source Power Requirements
Wednesday 14th May 2014
Toshiba and SanDisk Sign Memorandum of Understanding 
Monday 12th May 2014
Technologists at SEMATECH Successfully Reduce Defects from Multi-layer Deposition of Mask Blanks, Meeting the Defect Requirements for Early Introduction of EUV
Friday 9th May 2014
The orders were secured by several major aerospace and defence customers
Friday 9th May 2014
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Friday 9th May 2014
The film combines high glass transition temperature and stress absorption with thermal performance in die‐attach power dissipation
Friday 9th May 2014
A new microscope could provide a process for stencilling patterns on silicon chips. The technique requires etching into the silicon through the spaces in the lithography stencil to transfer the pattern
Thursday 8th May 2014
The SIA says semiconductor sales reached $78.6 billion in the first quarter of 2014

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