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Tuesday 15th April 2014
Drivers in this market are sizes of less than 45 nm and increased manufacturing in the Asia-Pacific region, with Taiwan being the most dominant
Monday 14th April 2014
This sector has been invigorated by resurgent activity. In 2013 the top five spenders were the U.S., China, Japan, Germany and France
Monday 14th April 2014
Solid-state chemistry and theoretical physics combined have helped scientists to discover that europium titanium oxide, when stretched, could be used for data storage
Monday 14th April 2014
The firm's thin film chips incorporate a moisture-resistant tantalum nitride film. They are designed for use in low-noise, high-precision control systems for military, aerospace, telecommunications, and industrial applications
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Monday 14th April 2014
The system is capable of imprinting structure, with sizes ranging from 20nm and upwards, on substrate sizes up to 200 mm in diameter
Friday 11th April 2014
Scientists also see applications for batteries, biosensors and optical electronics as outlets for this new material
Friday 11th April 2014
The firm has invested $22 million and has used the cash to deliver completed construction as well as used some of it to launch operations
Friday 11th April 2014
The silicon computer giant has acknowledged twenty six companies in three different catagories for their support. These are the '2013 Intel Preferred Quality Supplier (PQS) award, the '2013 Supplier Achievement Award' and the '2013 Supplier Continuous Quality Improvement (SCQI) award'
Friday 11th April 2014
A  Pan-European research team intends to demystify nano, electronic and photonic codes
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Friday 11th April 2014
Thursday 10th April 2014
Strategy Analytics says LTE, 64-bit and multi-core demand will fuel a 10.8 percent CAGR revenue growth
Thursday 10th April 2014
The company's timing solutions enable each device to be configured to the customer’s exacting specifications
Thursday 10th April 2014
The UltraCMOS Global 1 power amplifier is claimed to be Industry’s first reconfigurable RF front end device. It enables a single platform design and supports TDD-LTE networks
Thursday 10th April 2014
A ruling was recently made that Camtek was in violation of Rudolph’s patent with its wafer inspection tool offerings
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Thursday 10th April 2014
Avago's core technology supports next generation HMC devices
Thursday 10th April 2014
The foundry was recognised for continued support, partnership commitment and delivery performance
Wednesday 9th April 2014
The development of mask writing and mask registration tools is a real enabler for the industry. Advances on both sides promote next generation lithography technologies such as Multi-Patterning, Directed Self-Assembly and EUV as well as EUV and 193i mix-and-match using cut masks
Wednesday 9th April 2014
A new development could pave the way for the development of next generation non-volatile spintronic components. This could be applied in data storage as well as logic and sensor modules

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