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Monday 7th April 2014
This region accounted for more than 68 percent of the Semiconductor & IC Packaging Materials Revenues in 2013
Monday 7th April 2014
The collaboration is intended to realise critical radio components for small battery-operated wireless devices
Monday 7th April 2014
The joint venture is intended to become the largest domestic supplier of leading edge photomasks in Taiwan
Monday 7th April 2014
The industry partnership will broaden ASE's SiP portfolio to meet growth momentum across a broad range of end markets. Inotera and ASE intend to enhance capability in the semiconductor supply chain
Monday 7th April 2014
IIT's latest iCub humanoid robot is powered by ST's MEMS accelerometers and gyroscopes which orientate the robot
Monday 7th April 2014
The firm has released new pumps for ultra-high vacuum applications and for installation in compact pump-system solutions and processes with small backing pumps
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Friday 4th April 2014
Products of excitation of contaminant molecules react with atomic oxygen to form simpler, volatile molecules, which desorb from the surface. This fast method of obtaining ultra-clean surfaces free of organic contaminants works on most substrates including silicon
Friday 4th April 2014
Friday 4th April 2014
While the world’s first Nikon 450mm immersion lithography tool comes online, wafer production is set to begin this June
Friday 4th April 2014
The firm has begun development of a new Bond on Finger (BOF) technology
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Thursday 3rd April 2014
Big changes occurred in the 2013 Top 20 Semi Supplier Ranking. The top four suppliers all have a different business model and include a pure-play IDM, vertically integrated IC supplier, pure-play foundriy, and fabless company
Thursday 3rd April 2014
Intel is working with IDT to offer customers a low risk path to enable the DDR4 memory platform. IDT is also a supplier to Micron
Thursday 3rd April 2014
A programmable ultra-fast micro mirror array for optical microscopes could enable the study of the influence of specific genes on organism development with far greater precision than before
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Wednesday 2nd April 2014
Microchips from IMS have a characteristic dimension of 0.35 µm, and are claimed to be considerably smaller than the high-temperature chips available today
Wednesday 2nd April 2014
The MEMS microphone market is tipped for strong growth
Wednesday 2nd April 2014
Ronald Goldblatt will be responsible for ensuring a smooth transition and leading SEMATECH’s executive team
Wednesday 2nd April 2014
Part of the agreement includes Inside Secure’s next generation NFC modem technology being transferred to Intel

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