Info
Info
News search:

< Page of 405 >

News


Tuesday 18th February 2014
This marks a step in demonstrating the capability of Gigaphoton’s most advanced high-power GT64A light source for high volume production in 450mm lithography processes
Tuesday 18th February 2014
The patent which ITC has issued against relates to internet integrated circuit probe cards
Monday 17th February 2014
This milestone moves the lithography industry closer to production-level LPP EUV light sources
Monday 17th February 2014
Silicon nanoparticles encased in carbon and clustered like seeds in a pomegranate hold together and conduct electricity and minimise reactions with the battery’s electrolyte that can degrade performance
Monday 17th February 2014
Adoption of a SSOP16 package contributes to a reduction of assembly cost for small fan motors
Info
Friday 14th February 2014
The merger will create an independent spin out company that will focus on developing nanotechnology market opportunities
Thursday 13th February 2014
The versatile, highly integrated modules prolong battery life with new envelope tracking technology. They also simplify complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners
Thursday 13th February 2014
The firms presented the ultra-wide-voltage range device at the International Solid-State Circuits Conference (ISSCC) 2014
Thursday 13th February 2014
The new company, BrPhotonics, is set to provide advanced High-Speed Components for Optical Communications utilising Silicon Photonics (SiPh) and Thin Film Polymer on Silicon Technologies. The aim is to advance 100Gbps to 1Tbps fibre-optic long haul, metro links and Cloud-connectivity in CFP2 and CFP4 applications
Info
Thursday 13th February 2014
The firm's customer has selected the Prim single-station chamber for advanced dielectric etcher production of 16nm Flash applications
Wednesday 12th February 2014
Wednesday 12th February 2014
The first NSX 320 metrology system has been sold specifically for Through Silicon Via (TSV) process development. It includes specialised sensors to measure critical parameters in 3D integration
Wednesday 12th February 2014
Info
Wednesday 12th February 2014
Wednesday 12th February 2014
The organisations demonstrated the chip at ISSCC2014. It signals an important achievement in enabling implantable cardiac monitoring solutions
Wednesday 12th February 2014
At the 2014 IEEE International Solid-State Circuits Conference, the firm presented its XLL SRAM chip
Wednesday 12th February 2014
The firm's power conversion solution with multi-level pulsing enables exceptional Pplasma management for PECVD, PEALD, and advanced etch applications

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info