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Thursday 10th April 2014
The company's timing solutions enable each device to be configured to the customer’s exacting specifications
Thursday 10th April 2014
The UltraCMOS Global 1 power amplifier is claimed to be Industry’s first reconfigurable RF front end device. It enables a single platform design and supports TDD-LTE networks
Thursday 10th April 2014
A ruling was recently made that Camtek was in violation of Rudolph’s patent with its wafer inspection tool offerings
Thursday 10th April 2014
Avago's core technology supports next generation HMC devices
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Thursday 10th April 2014
The foundry was recognised for continued support, partnership commitment and delivery performance
Wednesday 9th April 2014
The development of mask writing and mask registration tools is a real enabler for the industry. Advances on both sides promote next generation lithography technologies such as Multi-Patterning, Directed Self-Assembly and EUV as well as EUV and 193i mix-and-match using cut masks
Wednesday 9th April 2014
A new development could pave the way for the development of next generation non-volatile spintronic components. This could be applied in data storage as well as logic and sensor modules
Wednesday 9th April 2014
The high-speed, industry-standard block erase products expand the company’s product portfolio
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Wednesday 9th April 2014
Innovation Village will bring together up to fifty of the most innovative European start-ups with investors from the semiconductor industry
Wednesday 9th April 2014
The firm's DDR4 memory integrated into the Intel Xeon processor E5-2600 v3-based systems should improve performance and lower power consumption
Wednesday 9th April 2014
The organisation is holding a celebration to honour the achievements of semiconductor companies. There are several categories ranging from outstanding leadership to financial accomplishments, as well as overall respect within the industry
Tuesday 8th April 2014
The device is a coupling of a tiny doughnut shaped optical resonators - one with gain and the other with loss - on a silicon chip
Tuesday 8th April 2014
With global sales of $43.5 billion, declines in silicon revenue, advanced substrates, and bonding wire contributed to the year-over-year decrease
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Tuesday 8th April 2014
The firm says incumbent gallium arsenide-based RF solutions do not rise to the challenge of new complexity in the telecoms market
Tuesday 8th April 2014
In 2013, lithography and similar processes fared well unlike back-end manufacturing segments
Tuesday 8th April 2014
Among the recipients of the award were: LG Siltron, for silicon wafers ; Evets Global for refurbished tools, upgrades, and service and AutoStore by Hatteland for installation of an Autostore and automated material handling system
Monday 7th April 2014
This region accounted for more than 68 percent of the Semiconductor & IC Packaging Materials Revenues in 2013
Monday 7th April 2014
The collaboration is intended to realise critical radio components for small battery-operated wireless devices
Monday 7th April 2014
The joint venture is intended to become the largest domestic supplier of leading edge photomasks in Taiwan

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