News Article
Akrion begins joint development programs to advance packaging
Akrion Systems has engaged in two new Joint Development Programs (JDPs) with major semiconductor research organisations, both located in Europe.
The two programs are focused on wet processing areas in the 3D integration of semiconductor devices.
The work in both partnerships will focus on improving yields and reducing costs for critical process steps in through-silicon via (TSV) formation, metal etching during micro-bump formation and residue cleaning after etching steps in the process of creating metal interconnects.
The two JDPs will be ongoing through the second quarter of 2015.
Michael Ioannou, Akrion Systems President and CEO states, "We are excited to be working with some of the industry's leading scientists to develop innovative processes which enhance the capabilities of 3D device packagers. Cooperation of this type is the fastest way to enable the technology to advance in the fastest growing market segment in the semiconductor industry."
Akrion Systems will also participate in the upcoming 10th International Conference and Exhibition on Device Packaging, organised by IMAPS, the International Microelectronics Assembly and Packaging Society.
The conference will take place from March 11th to 13th at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona.
Hongseong Sohn and John Tracy will present on "Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks." Their work is in aimed at reducing process time, chemical consumption and overall cost in the area of copper pillar and micro-bump formation.
The two programs are focused on wet processing areas in the 3D integration of semiconductor devices.
The work in both partnerships will focus on improving yields and reducing costs for critical process steps in through-silicon via (TSV) formation, metal etching during micro-bump formation and residue cleaning after etching steps in the process of creating metal interconnects.
The two JDPs will be ongoing through the second quarter of 2015.
Michael Ioannou, Akrion Systems President and CEO states, "We are excited to be working with some of the industry's leading scientists to develop innovative processes which enhance the capabilities of 3D device packagers. Cooperation of this type is the fastest way to enable the technology to advance in the fastest growing market segment in the semiconductor industry."
Akrion Systems will also participate in the upcoming 10th International Conference and Exhibition on Device Packaging, organised by IMAPS, the International Microelectronics Assembly and Packaging Society.
The conference will take place from March 11th to 13th at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona.
Hongseong Sohn and John Tracy will present on "Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks." Their work is in aimed at reducing process time, chemical consumption and overall cost in the area of copper pillar and micro-bump formation.
