Semiconductor sales in Europe grew faster than the worldwide market in October according to the World Semiconductor Trade Statistics (WSTS) organisation. This is the fourth successive month where the European market exhibited growth.
Intel Corporation and Advanced Micro Devices Incorporated (AMD) in the third quarter (Q3) both managed to gain share in the global microprocessor market due to robust sales of PCs and servers and the cessation of the companies' price war, according to iSuppli Corporations's final ranking.
Taiwan Semiconductor Manufacturing Company Limited has announced that it has shipped its one-millionth 12-inch 90-nanometer (nm) wafer in record time. The record was reached in just 53 months, surpassing the 58 months it took the 0.13-micron process to reach that milestone.
Tokyo Ohka Kogyo Company Limited (TOK) and Dow Corning Electronics have announced that their new, jointly developed bilayer photoresist is being used in production for the first time by a leading manufacturer of DRAM chips.
In an ironic twist of fate, a slowdown in semiconductor production and an associated drop in demand for silicon wafers will ease the shortage of polysilicon used for solar cell production and impact manufacturers as well as equipment suppliers according to a report by The Information Network.
Trina Solar has announced that it has successfully reached 100% commercial production of 200 micron thickness wafers, down from the previously used 220 micron thickness as the company attempts to improve silicon usage and lower manufacturing costs.
Amid strong growth in global NAND flash memory sales in the third quarter, Hynix Semiconductor Incorporated, Micron Technology Incorporated and Intel Corporation, impressively outperformed the competition, according to a preliminary ranking from iSuppli Corporation.
Applied Materials Incorporated has unveiled its Applied UVision 3 system, the industry's highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography.
MagnaChip Semiconductor Limited, an Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, have announced that it will hold its third Annual Foundry Symposium in Seoul, Korea, on Thursday, November 29th.
On Seminconductor, a supplier of efficient power solutions, has been honoured by the European Council for Nuclear Research (CERN), with an Industrial Award recognising the company's contribution in supplying complex ‘Pixel Particle Sensor' chips for use in CERN's ATLAS particle physics experiment.
ENIAC has presented a fully revised version of its Strategic Research Agenda that in its previous releases has already influenced national, trans-national and European research programs in the advanced and strategic field of Nanoelectronics.
At the MEDEA+ Annual Forum, held in Budapest, an outline of major achievements in;micro- and nanoelectronic innovations was delivered. In the rapidly changing global industrial landscape, Europe's high-tech industry is exposed to ever-increasing technological, economical and societal challenges but has a clear vision on how to exploit new market opportunities.
MEMSCAP, a provider of innovative solutions based on MEMS (micro-electro-mechanical-systems) technology, has announces it has finalised the acquisition of 100% of the share capital and voting rights of French company Laboratoires La Licorne, the skin biodermatological treatment specialist.
AIXTRON AG have announced the installation and commissioning of a Nanoinstruments Black Magic 2 inch R&D piece of equipment for carbon nanotube (CNT) growth at the Physics and Chemistry Research Facility, University of Tuebingen, Germany.
The MEMS Industry Group (MIG), a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed an alliance to support each other's goals and industry events, through a variety of marketing programs.
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, have announced that it is expanding its flip chip offering to provide customers a complete turnkey solution in China.