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Tuesday 11th December 2007
The SEZ Group has announced that its Board of Directors has signed a binding transaction agreement with Lam Research Corporation, headquartered in Fremont, Calif. U.S.
Tuesday 11th December 2007
The SEZ Group has announced that its Board of Directors has signed a binding transaction agreement with Lam Research Corporation, headquartered in Fremont, Calif., U.S.
Tuesday 11th December 2007
JSR Micro Incorporated, the US operations of JSR Corporation of Tokyo, Japan, have announced that it has entered a joint research agreement with IBM to explore new technologies for emerging semiconductor materials and processes.
Tuesday 11th December 2007
Nova Measuring Instruments Limited, a provider of stand-alone metrology and of integrated metrology solutions to the semiconductor process control market, announced that a major top 10 semiconductor memory manufacturer has selected the NovaScan platform as its integrated metrology solution for CMP process control in all manufacturing facilities in Korea and China.
Tuesday 11th December 2007
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone’ in handling and processing of ultrathin wafers.
Tuesday 11th December 2007
The U.S. Department of Energy (DOE) has awarded Xidex Corporation, an Austin, Texas based nanotechnology company a contract for scaleable manufacturing of carbon nanotube (CNT) based field emission sources for use in scanning electron beam instruments such as scanning electron microscopes (SEMs) and transmission electron microscopes (TEMs).
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Tuesday 11th December 2007
NIL Technology has increased the availability of cost-efficient nanostructures for nanoimprint lithography (NIL).
Tuesday 11th December 2007
Using room-temperature processing, researchers at the Georgia Institute of Technology have fabricated high-performance field effect transistors with thin films of Carbon 60, also known as fullerene.
Tuesday 11th December 2007
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone' in handling and processing of ultrathin wafers.
Monday 10th December 2007
Semiconductor analyst house Future Horizons has summarised what it describes as a disappointing year for the semiconductor industry in 2007 and gave its predictions for a more respectable 2008.
Monday 10th December 2007
KLA-Tencor Incorporated and Nikon Corporation have collaborated to develop a set of fully automated overlay correction control system tools, called Scanner Match Maker (SMM), that chipmakers can use to correct overlay errors common to ‘mix and match' lithography strategies which use lithography tools of varying capabilities and from different suppliers.
Monday 10th December 2007
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Monday 10th December 2007
M+W Zander (Shanghai) Company Limited, China, has been awarded a new major contract for design and construction of the most advanced semiconductor factory in China. The company of the M+W Zander Group was appointed as general contractor for engineering, procurement and construction.
Monday 10th December 2007
Bosch continues to grow in India. Sales of the Bosch Group with customers in India are expected to grow by nearly 20%, to roughly €815 million.
Thursday 6th December 2007
It has been reported that chip manufacturers in Asia are expanding output faster than in the rest of the world, and will continue to do so, according to new research.
Wednesday 5th December 2007
A key industry milestone has been reached surrounding the handling and processing of ultrathin wafers.
Wednesday 5th December 2007
Novellus Systems Incorporated has announced that it has qualified several companies as licensed partners to support customers for manufacturing, service and spare parts of its refurbished and Classic equipment.
Wednesday 5th December 2007
ATMI, Incorporated has announced it has entered into an agreement with IBM to jointly develop and demonstrate advanced chemical formulations for highly implanted photoresist strip applications that will allow the design and production of next-generation semiconductor devices targeting 45-nanometer and future device manufacturing processes.
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Tuesday 4th December 2007
Samsung Electronics Company Limited and Toshiba Corporation have announced that they have licensed to one another the rights to produce, market and sell memory with the specifications and trademarks of Samsung's OneNAND and Toshiba's LBA-NAND memory chips.
Tuesday 4th December 2007
The leading manufacturers of semiconductor equipment project 2007 sales are to reach US$41.68 billion according to the year-end edition of the SEMI Capital Equipment Consensus Forecast, released by SEMI at the annual SEMICON Japan exposition.
Tuesday 4th December 2007
ATDF and SVTC Technologies have announced a merger that could change the landscape for semiconductor and nanotechnology development by expanding secure, cost-effective access to advanced process tools and capabilities for a wide range of technology companies.
Monday 3rd December 2007
Aviza Technology Incorporated, a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, has reported results for the fourth quarter and year-end of fiscal year 2007.
Monday 3rd December 2007
Cymer Incorporated, a supplier of excimer laser light sources used in semiconductor manufacturing, announced the company reached its goal of demonstrating 100 watts of extreme ultraviolet (EUV) burst power at the 2007 International EUVL Symposium held recently in Sapporo, Japan.
Monday 3rd December 2007
Semilab Co. Limited and SSM Incorporation, both manufacturers of materials metrology solutions to the semiconductor and solar industries, have announced that they have jointly signed a letter of intent whereby Semilab will acquire SSM.

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