ASE expanding manufacturing and packaging in Taiwan
Advanced Semiconductor Engineering, Inc. (ASE), one of the world's largest semiconductor assembly and test service providers, has broken ground to mark the construction of two new buildings in Taiwan.
Buildings B and C are based at the Kaohsiung Nantze Export Processing Zone II. The new buildings are part of ASE's plans to expand its manufacturing capacity for advanced semiconductor packaging processes and its R&D centre.
Last year, ASE broke ground for the construction of building A, which is due to be completed at the end of 2013. Buildings A and B are designated for production, while building C will be the R&D centre. The land area housing these buildings is 13,238 square metres, while the build up production area is 75,549 square metres.
Completion of the construction of buildings B and C is estimated to be in the third quarter of 2014. These building projects are constructed based on green design concepts and ASE has implemented a framework to meet the criteria set by Taiwan's EEWH and US Green Council's LEED (Leadership in Energy and Environmental Design) for green building certification.
In consideration of the environment and community, the architecture design at the ASE campus will include greenery, art and culture.
Technology continues to drive the plethora of smart devices available in the consumer market, such as smartphones and tablets. IC chip designers are continuously designing smaller, lighter and more powerful semiconductors that require higher pincount, narrower pitch traces and miniaturisation.
ASE Kaohsiung's new factories will provide customers access to production capacities using more advanced process capabilities in bumping, copper pillar, TSV, flip chip and 3D IC packaging.
The R&D centre will hire about 160 engineers to develop and work with customers on advanced technologies. With the development of the R&D centre, ASE hopes to register 250-300 new patents each year, boosting its competitive advantage. Buildings B and C will also open up hiring opportunities for over 3,500 new employees and add potential revenue of $530 million per year.
The ASE Group is one of the world's largest providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing.
The company aims to meet the growing needs for faster, smaller and higher performance chips. It develops and offers IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group.
