SanDisk Corporation, have outlined plans currently being worked out with its long-standing manufacturing partner Toshiba for the construction and ramp of a new 300mm facility, dubbed Fab 5, for NAND flash production.
The Bosch Group has celebrated the completion of its new headquarters and expansion of its Technical Centre in Yongin, Gyeonggi with government officials, customers, other business partners and associates.
Foundry, Semiconductor Manufacturing International Corporation (SMIC) and Magma Design Automation Incorporated, a provider of semiconductor design software, have jointly announced the availability of an enhanced low-power IC implementation reference flow for SMIC's 90-nanometer (nm) process featuring Magma's Blast Power, Blast Fusion, and Blast Create.
The pressure for shorter times to market is pushing electronic equipment manufacturers to look beyond their trusted supply chain for quick delivery of components which are difficult to source. This has led to the growth of component counterfeiting. A recent report estimated the losses to customers falling victims of counterfeiters exceeded US$15 billion per annum.
It has been reported that amid some major changes taking place at the 45-nm node and beyond, Axcelis Technologies Inc. has decided to cease future product development in the rapid thermal processing (RTP) tool arena.
STMicroelectronics has introduced its new automotive-grade application processor with embedded GPS for navigation and telematics. The Cartesio processor perfectly couples with ST's GPS RF chip (STA5620), creating a unique offering that significantly reduces the form factor and bill-of-materials with no compromise in performance.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced the successful installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria.
The Microsystems Packaging Research Center (PRC) at the Georgia Institute of Technology in Atlanta and IMEC have invited interested parties from global industry to join their advanced research program on next-generation flip-chip and substrate technology.
Molecular Imprints, Inc. (MII) has announced that Toshiba Semiconductor Company, a global leader in the development and manufacturing of powerful semiconductor devices, has validated the use of MII's imprint lithography technology in developing 22-nm node CMOS devices.
A team of researchers at IBM Corporation has reported that they have measured the distribution of electrical charges in tubes of carbon measuring smaller than 2-nm in diameter, which is 50,000 times thinner than a human hair.