STATS ChipPAC Ltd, an independent semiconductor test and advanced packaging service provider, has announced that it has completed the acquisition of LSI Corporation's assembly and test operation in Pathumthani, Thailand.
Researchers at the Fraunhofer Institute for Laser Technology ILT have developed a non-contact soldering system in which the temperature is constantly monitored. If the temperature deviates beyond set limits, the system automatically adjusts it to an acceptable value.
American Air Liquide Holdings, Inc, has announced an agreement to purchase the assets of Scott Specialty Gases, Inc, a leading privately held international producer and supplier of value-added mixed and pure high specialty gases.
The Korean Times has written that Hynix Semiconductor will raise the portion of the over 1-gigabit dynamic random access memory (DRAM) chips to 60% of its total DRAM output by the end of the year, to produce more profitable advanced chips.
Metrosol Incorporated, a developer, manufacturer and worldwide supplier of short wavelength optical metrology solutions, and SEMATECH, the global consortium of leading chipmakers, have demonstrated their inline optical metrology for high-k gate dielectric composition, thickness, and most importantly, ultra-thin interfacial layer thickness.
C-MAC MicroTechnology and Danfoss Silicon Power have announced a strategic partnership to co-develop and manufacture intelligent, compact power modules targeted at the rapidly growing automotive sector.
ChipSensors Ltd, a fabless semiconductor start-up company, has unveiled a breakthrough in semiconductor technology enabling the surface of the chip itself to sense parameters such as temperature, humidity, certain gases and pathogens.