Shares of Tundra Semiconductor Corporation, a maker of telecom system interconnect equipment, have fallen after the Ottawa company warned it will generate lower than expected profits and revenues for its latest quarter because of weakening markets and the impact of a stronger Canadian dollar.
KMG Chemicals has entered into an agreement to acquire the High-Purity Process Chemicals (HPPC) business from Air Products and Chemicals that had revenues in the last 12 months of approximately US$90 million for US$74.6 million.
Samsung Electronics has revealed that its NAND flash devices at the 30nm node, which it expects to enter volume production in 2009, will adopt a double patterning self-aligned hardmask process that does away with the need for charge trap flash (CTF) technology.
It has been reported that a new study by researchers at Rensselaer Polytechnic Institute (St. Troy, N.Y.) has found that blocks of Carbon nanotubes (CNTs) can be used to create effective and powerful pressure sensors.
Aquest Systems, a developer of innovative automation solutions for the global semiconductor industry, has announced that the United States Patent and Trademark Office (USPTO) has issued a broad patent to protect Aquest's FabEX automated material handling system (AMHS). While most patents take more than three years to receive, this patent only took 18 months due to a special accelerated examination granted by the USPTO.
Spansion Incorporated, a pure-play provider of Flash memory solutions, has announced that it has intensified its focus in the China market by partnering with Semiconductor Manufacturing International Corporation.
NanoDynamics Incorporated has announced the recent formation of a joint venture with Shell Technology Ventures Fund 1 B.V. to develop new materials and products expected to improve exploration and production efforts in the international oil and gas industry.
Applied Materials has expanded its solutions for TFT-LCD flat panel display (FPD) manufacturing, with the launch of its AKT-PiVot 55KV PVD system for depositing metal and TCO materials on Gen 8.5 (5.5m2) glass substrates.
Vitex Systems, Incorporated, a leading technology developer, licensor and engineering service provider for thin-film encapsulation and moisture barrier films, has announced that its equipment licensee, Advanced Neotech Systems (ANS) of Korea, has secured a purchase order for its Guardian thin-film encapsulation system from a major Japanese customer.
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced the grand opening of a second 371,000 square ft manufacturing facility in Shanghai, China.
SanDisk Corporation, have outlined plans currently being worked out with its long-standing manufacturing partner Toshiba for the construction and ramp of a new 300mm facility, dubbed Fab 5, for NAND flash production.
The Bosch Group has celebrated the completion of its new headquarters and expansion of its Technical Centre in Yongin, Gyeonggi with government officials, customers, other business partners and associates.