The Korean Times has written that Hynix Semiconductor will raise the portion of the over 1-gigabit dynamic random access memory (DRAM) chips to 60% of its total DRAM output by the end of the year, to produce more profitable advanced chips.
Metrosol Incorporated, a developer, manufacturer and worldwide supplier of short wavelength optical metrology solutions, and SEMATECH, the global consortium of leading chipmakers, have demonstrated their inline optical metrology for high-k gate dielectric composition, thickness, and most importantly, ultra-thin interfacial layer thickness.
C-MAC MicroTechnology and Danfoss Silicon Power have announced a strategic partnership to co-develop and manufacture intelligent, compact power modules targeted at the rapidly growing automotive sector.
ChipSensors Ltd, a fabless semiconductor start-up company, has unveiled a breakthrough in semiconductor technology enabling the surface of the chip itself to sense parameters such as temperature, humidity, certain gases and pathogens.
Sigma-Aldrich has announced its intent to invest in a site at the Wuxi-New District Park (WND) located northwest of Shanghai, China, for its new Asia-Pacific manufacturing hub. Sigma-Aldrich has executed a memorandum of understanding with the WND authorities.
Rohm and Haas Electronic Materials have introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond.
STMicroelectronics has announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications.
ASML have announced that a Taiwanese customer using its TWINSCAN i-Line scanners has achieved an unprecedented level of 300mm productivity by processing 150 wafers per hour for 24 hours, reaching a record output of 3,596 wafers in a single day.