Info
Info
News search:

< Page of 415 >

News


Friday 28th September 2007
Wipro Ltd, India's third-biggest software exporter, have announced it was acquiring the wireless design subsidiary of Oki Electric Industry Co Ltd (OTCS) to help it expand in Japan and east Asia.
Friday 28th September 2007
It has been announced that ersol Solar Energy AG will deliver multi and monocrystalline silicon solar cells to module producer Solar Semiconductor Pvt. Ltd, based in India and the United States.
Friday 28th September 2007
The Korean Times has written that Hynix Semiconductor will raise the portion of the over 1-gigabit dynamic random access memory (DRAM) chips to 60% of its total DRAM output by the end of the year, to produce more profitable advanced chips.
Thursday 27th September 2007
Asymtek, a company specialising in dispensing technology and pioneer in jetting technology, announces the opening of its new technical support and sales office in Chennai, India.
Thursday 27th September 2007
The University of Alabama (UA) and Imago Scientific Instruments announced plans to establish a new research facility for atom probe tomography (LEAP microscopy).
Thursday 27th September 2007
Metrosol Incorporated, a developer, manufacturer and worldwide supplier of short wavelength optical metrology solutions, and SEMATECH, the global consortium of leading chipmakers, have demonstrated their inline optical metrology for high-k gate dielectric composition, thickness, and most importantly, ultra-thin interfacial layer thickness.
Info
Wednesday 26th September 2007
iSuppli Corp. has reduced its forecast of global semiconductor revenue growth in 2007 to 3.5 percent, down from its previous prediction of a 6 percent rise.
Wednesday 26th September 2007
C-MAC MicroTechnology and Danfoss Silicon Power have announced a strategic partnership to co-develop and manufacture intelligent, compact power modules targeted at the rapidly growing automotive sector.
Wednesday 26th September 2007
Synplicity, Inc. have announced an addition to its HAPS (High-performance ASIC Prototyping System) product family.
Wednesday 26th September 2007
MEMSCAP has announces it is a major supplier for L-3 Communications Avionics Systems revolutionary SmartDeck Integrated Flight Controls and Display System.
Tuesday 25th September 2007
Keithley Instruments have announced a new partnership with The California NanoSystems Institute at UCLA.
Wednesday 19th September 2007
Intel has demonstrated new products, chip designs and manufacturing technologies, including the world’s first working 32 nanometer (nm) chips, to begin production in 2009.
Info
Tuesday 18th September 2007
ChipSensors Ltd, a fabless semiconductor start-up company, has unveiled a breakthrough in semiconductor technology enabling the surface of the chip itself to sense parameters such as temperature, humidity, certain gases and pathogens.
Tuesday 18th September 2007
Sun Yat-Sen University, one of the leading research centres in China, has chosen to use the Thomas Swan Close Coupled Showerhead (CCS) MOCVD reactor in 3x2-inch wafer configuration.
Tuesday 18th September 2007
Coventor Incorporation, the leading supplier of 3D software for the MEMS and semiconductor industries, has greatly enriched its schematic-based MEMS design environment ARCHITECT.
Monday 17th September 2007
According to reports by the Financial Times and other services, Sony Corporation plans to terminate production of state-of-the-art computer microchips.
Monday 17th September 2007
Xilinx, one of the largest fabless semiconductor companies, has opened a new and expanded regional headquarters in the Changi Business Park, Singapore.
Friday 14th September 2007
Sigma-Aldrich has announced its intent to invest in a site at the Wuxi-New District Park (WND) located northwest of Shanghai, China, for its new Asia-Pacific manufacturing hub. Sigma-Aldrich has executed a memorandum of understanding with the WND authorities.
Info
Friday 14th September 2007
Rohm and Haas Electronic Materials have introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond.
Friday 14th September 2007
Samsung Electronics has developed the first 60 nanometer (nm)-class 2 gigabit DDR2 DRAM and will begin mass production later this year.
Friday 14th September 2007
STMicroelectronics has announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications.
Friday 14th September 2007
MAPPER Lithography has reached an important milestone in the development of its highly innovative lithography machine for advanced chip manufacturing.
Wednesday 12th September 2007
SUSS MicroTec have announced it has received the first order for its new Gamma XPress coat / develop cluster from Rohm and Haas Electronics Materials.
Wednesday 12th September 2007
ASML have announced that a Taiwanese customer using its TWINSCAN i-Line scanners has achieved an unprecedented level of 300mm productivity by processing 150 wafers per hour for 24 hours, reaching a record output of 3,596 wafers in a single day.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}