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Friday 31st August 2007
SiTime Corporation has announced that their SiT8002 and SiT1 oscillator families are shipping at a production rate of more than 100,000 units per week.
Friday 31st August 2007
IMEC has announced that QUALCOMM Incorporated has joined IMEC’s technology-aware design program (TAD). IMEC and QUALCOMM will be collaborating on circuit and system design methodologies.
Friday 31st August 2007
Carl Zeiss SMT and Intellection Pty have announced a long-term strategic agreement reinforcing the successful co-operation between the two companies. The agreement defines the relationship for the development and supply of Carl Zeiss SMT's Scanning Electron Microscope (SEM) for use in the Intellection's QEMSCAN automated quantitative mineralogy system.
Friday 31st August 2007
Twenty years after two IBM scientists won the Nobel Prize in Physics for their design of the Scanning Tunnelling Microscope (STM), which opened the world to individual atoms for the first time, scientists and engineers from IBM Research continue to break new ground in so-called nanotechnology.
Friday 31st August 2007
Alcatel Micro Machining Systems has announced that it has received an order from STMicroelectronics (ST) for its new AMS 4200 production tool for advanced device technology.
Friday 31st August 2007
IBM Corp. and Infineon Technologies have announced an agreement in principle to divest their shares in Altis Semiconductor with its manufacturing site in Corbeil-Essonnes, France, via a sale to Advanced Electronic Systems (AES).
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Friday 31st August 2007
The fast development of China¹s micro/nanotechnology business poses threats but also offers Opportunities to western companies according to a report by enablingMNT Industry.
Friday 31st August 2007
DEK has announced a new strategic partnership with BTU International, an alliance which will see the two technology companies deliver complete in-line metallisation process solutions for solar cell manufacturers.
Thursday 30th August 2007
DEK has opened a new manufacturing facility in Shenzhen, China as part of its ongoing strategic expansion programme in the region.
Thursday 30th August 2007
AmberWave Systems has announced that they, along with Rochester Institute of Technology (RIT), were awarded a three-year research grant from the National Science Foundation (NSF). ;;
Thursday 30th August 2007
LSI Corporation has announced that it has joined The Green Grid, a non-profit consortium of information technology companies and professionals seeking to lower the overall consumption of power in data centres around the globe.
Thursday 30th August 2007
Dongbu HiTek has announced that it will soon commence volume production of low-power 8MB/3V static random access memory (SRAM) devices for EMLSI.
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Wednesday 29th August 2007
BOC Edwards, Inc. has signed a definitive agreement under which Edwards will divest the majority of its parts cleaning and chamber process kit management division, Kachina, to Applied Materials, Inc.
Wednesday 29th August 2007
Asia is one of Air Liquide's Electronics key growth drivers, with 80% of the upcoming Fabs being commissioned in this region and 100% of the flat panel manufacturing industry.
Wednesday 29th August 2007
Mentor Graphics Corporation has announced an agreement with the College of Automotive Engineering of Tongji University, China to set up a Joint Lab and Technical Training Centre for Auto Electronic System Design in Shanghai.
Wednesday 29th August 2007
Showcasing embedded design innovation among engineering students in China, Freescale Semiconductor has staged the finals of the Freescale Cup National Smart Car University Design Competition at Shanghai Jiaotong University.
Tuesday 28th August 2007
The Advanced Technologies and Ventures Business for Dow Corning Corporation has been awarded a U.S. patent on a new method for making low dielectric constant (low-k) silicon carbide (SiC) and hydrogenated silicon oxycarbide (H:SiOC) thin films.
Tuesday 28th August 2007
REC has entered into an agreement to build and own a 2.5 MW solar power plant in South Korea.
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Friday 24th August 2007
Applied Materials, Inc. has announced that it has completed the acquisition of HCT Shaping Systems (HCT).
Thursday 23rd August 2007
Eyelit, Inc. has announced that a Photovoltaic (PV) Solar Cell producer has selected Eyelit's Enterprise Manufacturing Execution Suite to support manufacturing of Copper Indium Gallium Selenide (CIGS) Solar Panel Production.
Thursday 23rd August 2007
The Forschungszentrum Karlsruhe, R&D centre has started running its new Electron Beam Lithography system (EBL), Vistec VB6.
Wednesday 22nd August 2007
To support its embedded technology customers, Intel Corporation has announced plans to extend its embedded NOR flash products to the 65-nanometer (nm) generation.
Wednesday 22nd August 2007
In the recent 7 years of semiconductor manufacturing the industry went through a significant technology node. An increase in size of the silicon wafer, to 300 mm, was adopted to increment productivity.
Wednesday 22nd August 2007
German engineering conglomerate Siemens has said that its Power Transmission & Distribution unit plans to create a joint venture with Infineon Technologies for the development and production of power semi-conductors.

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