AmberWave Systems has joined three other New Hampshire-based organizations, as well as more than 100 additional signatories, including universities, venture capital firms, small and large technology businesses, and research parks across the U.S. to voice their concern with certain provisions of patent reform legislation currently under consideration by Congress.
Anchor Semiconductor and Semiconductor Manufacturing International Corporation (SMIC) have jointly announced the expanded applications and commitment of Anchor's NanoScope Platform solutions in SMIC's advanced manufacturing flows at 65nm node and beyond.
Mentor Graphics Corporation has announced that UMC has expanded its support for the Calibre nm Platform with Calibre YieldAnalyser for all major design flows for its 90 nanometre (nm) and 65nm processes.
Extreme DA and Semiconductor Technology Academic Research Centre (STARC) are collaborating to jointly develop and validate a variability-aware timing analysis flow for integrated circuits (ICs) manufactured in 65- and 45-nanometer (nm) processes.
Members of the International SEMATECH Manufacturing Initiative (ISMI) have agreed to draft a "green fab standard" aimed at building semiconductor factories that will use less energy and water, minimise waste and air pollution, and ultimately save money for chip-makers.
STATS ChipPAC has announced plans to establish a new research and development (R&D) facility located in Singapore which will be dedicated to developing next generation technology including through silicon via (TSV) and microbump bonding for three dimensional (3D) die, silicon substrate based packaging solutions, and embedded active die technology.
FSI International has announced that the U.S. Patent and Trademark;Office has awarded the company a patent for a method which produces ultra-uniform etch results in combination with a rinse/dry step in a single immersion tank for front-end-of-line (FEOL) critical cleans
Samsung Electronics Co has announced that 21 of its DDR3 solutions have been validated on Intel Corporation's reference platform to work with Intel's next generation DDR3 (Double Data Rate – Version 3) chipsets.
Asyst Technologies, Inc. announced that its 200mm products have been selected by multiple semiconductor fabs including EM Microelectronic of Switzerland, Shanghai Huahong NEC Electronics Co., (HHNEC) of China and additional semiconductor fabs in China and Russia.
Elite Semiconductor Memory Technology Inc., Taiwan (ESMT) and Cypress Semiconductor Corp. have announced a Technology Transfer Agreement under which ESMT will acquire Cypress's Pseudo Static Random Access Memory (PSRAM) product line.
Semiconductor Industry Association (SIA) President George Scalise has heralded a bipartisan agreement between the Administration and Members of Congress that will pave the way for progress on key trade opening agreements