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Thursday 26th July 2007
A $4 million investment by New York State has further prepared Marcy NanoCentre for immediate development by the nanoelectonics industry.
Thursday 26th July 2007
Oerlikon Solar has announced that it has signed a contract with Taiwan's CMC Magnetics Corp. (CMC) for the supply of a 40-MWp thin-film solar cell production plant.
Wednesday 25th July 2007
The arrival of newly appointed professor Hiroshi Mizuta at the University of Southampton will pioneer research into making smaller, more powerful computers and mobile phones a reality when the new Mountbatten Building opens next year.
Wednesday 25th July 2007
Mallinckrodt Baker, Inc. has announced plans to move its BAKER ALEG-380 photoresist stripper and residue remover into its high-volume manufacturing facility.
Wednesday 25th July 2007
Mallinckrodt Baker, Inc. and the Energy research Centre of the Netherlands (ECN) have announced a new processing step in crystalline solar cell manufacturing that they claim provides a two percent relative increase in solar cell efficiency.
Wednesday 25th July 2007
NXP Semiconductors (NXP has announced the expansion of its presence in Singapore for the advancement of Wireless USB (W-USB) technology development.
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Wednesday 25th July 2007
Intel Corporation, STMicroelectronics and Francisco Partners have unveiled the company name of "Numonyx" for the pending independent semiconductor company announced in May this year.
Wednesday 25th July 2007
Mentor Graphics Corporation has announced a joint collaboration with RV-VLSI Design Centre, in Bangalore, India. Under the remit of its Higher Education Program, Mentor Graphics will provide the Centre with design tools for classroom instruction and academic research, by donating a complete suite of electronic design automation (EDA) tools.
Wednesday 25th July 2007
Corning Incorporated has announced plans to expand its optical fibre manufacturing facility in China. The decision is based on continued growth in the China optical fibre market.
Wednesday 25th July 2007
ASML Holding has announced that it has shipped its first TWINSCAN XT:1900i lithography system which it claims is capable of imaging features down to 36.5 nanometres (nm) on chips manufactured in volume. Production of the XT:1900i is now ramping up fast, as multiple orders have been placed and systems will be shipped before the end of this year to many device makers worldwide.
Wednesday 25th July 2007
Memsstar Technology has announced that it is to enter into a strategic alliance with SAFC Hitech to supply fully qualified memsstar SPDTM (Surface ;Preparation and Deposition) systems with standard precursor chemical materials from SAFC Hitech for Surface Coatings on micro devices. ;
Thursday 19th July 2007
Mattson Technology, Inc. has announced multiple Suprema strip system orders from a major microprocessor manufacturer.
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Wednesday 18th July 2007
With broad experience gathered over more than 40 years, Vistec Electron Beam and Vistec Lithography are leading developers, manufacturers and providers of electron beam lithography systems.
Wednesday 18th July 2007
Keithley Instruments, Inc. has announced that it has entered into a Joint Development Partnership (JDP) surrounding semiconductor device material testing technology with CEA Leti.
Wednesday 18th July 2007
Silterra Malaysia has reviewed its new growth plan following the recent announcement of its 90nm and 65nm technology development plan with IMEC. The expansion plan is staged in three phases to accelerate the Company to a high rate of growth for the next few years.
Wednesday 18th July 2007
MEMSCAP has announced that it has accepted a Purchase Order for a total amount of US$ 8.500.000, to manufacture a consumer product. This purchase order complements an initial one delivered over the first 2007 quarter for an amount of 0.3 million US dollars. ; ;
Tuesday 17th July 2007
To integrate new materials and processes in its gate structure to make chips faster and more power-efficient thus enabling Moore's Law to continue, Applied Materials, Inc. has unveiled new technologies to help achieve this by way of a new processes for building high-k/metal gate (HK/MG) structures in high volume production.
Tuesday 17th July 2007
The SAFC Hitech business segment within SAFC, a member of the Sigma-Aldrich Group has announced details of its new five-year chemical roadmap for Metalorganic Chemical Vapor Deposition (MOCVD) and Atomic Layer Deposition (ALD) processes on silicon semiconductor substrates.
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Tuesday 17th July 2007
CEA/Leti-Minatec and Alcatel Micro Machining Systems have announced their joint collaboration for the development of industrial process capability in DRIE and LTPECVD for 3D interconnect applications.
Tuesday 17th July 2007
Carl Zeiss SMT Inc. has announced that it has successfully shipped its first ORION Helium ion microscope to the National Institute of Standards and Technology (NIST).
Tuesday 17th July 2007
Metryx has announced that it has received orders from a major research consortium for its Mentor SF3 300 mm tool and Mentor OC23 200 mm tool. During the evaluation phase, the Mentor successfully identified previously undetected process trends, demonstrating the value mass metrology offers to the industry.
Tuesday 17th July 2007
Eco-Snow Systems has formed a joint development program with Belgian nanoelectronics research centre IMEC to develop and study photoresist and particle removal processes using CO2-based cryogenic cleaning systems.
Tuesday 17th July 2007
Advantest Corporation has announced that the Hsinchu District Court (Hsinchu City, Taiwan) granted a preliminary injunction against TechWing, Inc. following a petition filed by Advantest in February, 2006.
Tuesday 17th July 2007
One year after shifting the objective of its lithography program to the 32nm half pitch node, IMEC reports progress on high-index 193nm immersion lithography, double-patterning schemes for 193nm water-based immersion lithography and extreme UV (EUV) lithography.

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