STATS ChipPAC has announced plans to establish a new research and development (R&D) facility located in Singapore which will be dedicated to developing next generation technology including through silicon via (TSV) and microbump bonding for three dimensional (3D) die, silicon substrate based packaging solutions, and embedded active die technology.
FSI International has announced that the U.S. Patent and Trademark;Office has awarded the company a patent for a method which produces ultra-uniform etch results in combination with a rinse/dry step in a single immersion tank for front-end-of-line (FEOL) critical cleans
Samsung Electronics Co has announced that 21 of its DDR3 solutions have been validated on Intel Corporation's reference platform to work with Intel's next generation DDR3 (Double Data Rate – Version 3) chipsets.
Asyst Technologies, Inc. announced that its 200mm products have been selected by multiple semiconductor fabs including EM Microelectronic of Switzerland, Shanghai Huahong NEC Electronics Co., (HHNEC) of China and additional semiconductor fabs in China and Russia.
Elite Semiconductor Memory Technology Inc., Taiwan (ESMT) and Cypress Semiconductor Corp. have announced a Technology Transfer Agreement under which ESMT will acquire Cypress's Pseudo Static Random Access Memory (PSRAM) product line.
Semiconductor Industry Association (SIA) President George Scalise has heralded a bipartisan agreement between the Administration and Members of Congress that will pave the way for progress on key trade opening agreements
IC Insights' May update to The McClean Report describes the big shakeup in the 1Q07 top 20 semiconductor supplier ranking. The first quarter inventory correction in the IC industry helped cause a great deal of movement up and down the list in 1Q07 as compared to the full-year 2006 rankings.
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.