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Friday 4th June 2004
German mixed-signal specialist X-FAB Semiconductor has made available a 650V smart power technology (XD10H) based on a trench-isolated silicon-on-insulator (SOI) process.
Friday 4th June 2004
MotorolaÕs Freescale Semiconductor subsidiary/spin-out preparation vehicle has joined the effort of European companies STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly package technologies.
Friday 4th June 2004
ASM International has completed its acquisition of NuTool, a semiconductor equipment company based in Milpitas, California (Bulletin 520, March 4, 2004).
Wednesday 2nd June 2004
eASIC has taped out its first structured ASIC array to be fabricated by a European integrated device manufacturer (IDM) partner on a 0.13micron process. The taped-out array called FA1 is the smallest member of the company's Structured eASIC product family. The initial parts will be used to characterise timing and power for the structured ASIC fabric and cell libraries.
Wednesday 2nd June 2004
Novellus Systems has agreed to acquire Peter Wolters, a manufacturer of high-precision machine manufacturing tools headquartered in Rendsburg, Germany. The deal brings a chemical mechanical planarisation (CMP) product line (particularly tungsten and dielectric) to add to NovellusÕ existing CMP technology for semiconductor manufacturing. The acquisition is expected to close in the beginning Q3 2004. Novellus acquired CMP tool producer SpeedFam-IPEC in 2002.
Wednesday 2nd June 2004
The German Federal Ministry for the Environment, Nature Conservation and Nuclear Safety (BMU) will fund a joint research project on organic solar cells by GermanyÕs Hahn-Meitner-Institute (HMI), chemicals supplier Covion Organic Semiconductors and Aixtron. Within this project AIXTRON will install an organic vapour phase deposition (OVPD) system at the HMI for the deposition of organic thin films.
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Wednesday 2nd June 2004
Philips Electronics has appointed Rene Penning de Vries as senior vice president and chief technology officer (CTO) at PhilipsÕ semiconductor division. Penning de VriesÕ new role comes as part of the companyÕs preparation for Theo ClaasenÕs retirement scheduled for mid 2005. Claasen has been CTO at Philips Semiconductors since 1997.
Wednesday 2nd June 2004
EuropeÕs GALILEO radio navigation satellite system group launched its second call for proposals for research activities with an overall budget of EUR67mn. The aim is to support the development of applications and user receivers. The first call for proposals for GALILEO was made under the 6th Research Framework Programme (FP6) with eight large research activities beginning in 2003 and totalling EUR19mn.
Wednesday 2nd June 2004
International Rectifier (IR) plans to invest $40mn to bring on-line 200mm facilities and double production capacity at its site in Newport, Wales. International Rectifier's planned investment of $40mn in IR-Newport will result in more than 120 additional jobs and the potential to quadruple the facility's production capability in the future.
Wednesday 2nd June 2004
The German Federal Ministry for the Environment, Nature Conservation and Nuclear Safety (BMU) will fund a joint research project on organic solar cells by Germany's Hahn-Meitner-Institute (HMI), chemicals supplier Covion Organic Semiconductors and Aixtron.
Wednesday 2nd June 2004
UK R&D company Innos has invested GBP5mn to upgrade its photolithography capability, including the purchase of a JBX-9300FS electron-beam lithography system from JEOL UK. The new equipment, installed at Innos' 1000m2 clean room in Southampton is part of a strategy to provide a complete service to industry and academic institutions.
Wednesday 2nd June 2004
European nanotech research centre IMEC and Praesagus have agreed to jointly develop Praesagus' physics-based modelling approach for pattern-based interconnect thickness variation.
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Wednesday 2nd June 2004
Novellus Systems has agreed to acquire Peter Wolters, a manufacturer of high-precision machine manufacturing tools headquartered in Rendsburg, Germany.
Wednesday 2nd June 2004
Alcatel's Vacuum Technology division has rebranded its vacuum pumps, helium leak detectors and micro machining systems products under the new name Adixen.
Wednesday 2nd June 2004
UK fabless mixed-signal IC supplier Wolfson Microelectronics has contracted CSMC Technologies Corporation for foundry services from a 150mm fab facility in Wuxi, China.
Wednesday 2nd June 2004
Philips Electronics has appointed Rene Penning de Vries as senior vice president and chief technology officer (CTO) at Philips' semiconductor division.
Wednesday 2nd June 2004
The World Semiconductor Trade Statistics (WSTS) for April 2004 puts world IC sales at $16.94bn, a 36.6% increase on April 2003.
Wednesday 2nd June 2004
Samsung Electronics claims the industry's first "CVD aluminium" 70nm DRAM process technology. The aluminium chemical vapour deposition (CVD) process technology forms conducting films by turning aluminium metal-organic source materials into particles through chemical reactions, depositing them on the wafer surface.
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Wednesday 2nd June 2004
Advanced Interconnect Technologies (AIT) has fully qualified a complete green flip-chip small outline IC (FC-SOIC) narrow body package that meets OEM requirements for the MSL1 moisture and 260degreesC temperature packaging standards.
Wednesday 2nd June 2004
Silicon Microstructures (SMI) announced volume production of new lines of ultra-small sensors and co-integrated sensors on 150mm wafers.
Friday 28th May 2004
International Rectifier (IR) plans to invest $40mn to bring on-line 200mm facilities and double production capacity at its site in Newport, Wales. International Rectifier's planned investment of $40mn in IR-Newport will result in more than 120 additional jobs and the potential to quadruple the facility's production capability in the future.
Friday 28th May 2004
European nanotech research centre IMEC and Praesagus have agreed to jointly develop Praesagus' physics-based modelling approach for pattern-based interconnect thickness variation. The scope of the technology will be expanded to include copper/low-k and three-dimensional modelling. The partnership will use IMEC's copper damascene, ultra low-k dielectric and 65nm expertise and experience.
Friday 28th May 2004
Samsung Electronics claims the industry’s first “CVD aluminium” 70nm DRAM process technology. The aluminium chemical vapour deposition (CVD) process technology forms conducting films by turning aluminium metal-organic source materials into particles through chemical reactions, depositing them on the wafer surface.
Thursday 27th May 2004
UK R&D company Innos has invested GBP5mn to upgrade its photolithography capability, including the purchase of a JBX-9300FS electron-beam lithography system from JEOL UK. The new equipment, installed at InnosÕ 1000m2 clean room in Southampton is part of a strategy to provide a complete service to industry and academic institutions.

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