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Thursday 17th June 2004
Hynix Semiconductor has signed a business transfer agreement of its system IC division with System Semiconductor.
Thursday 17th June 2004
PVA TePla subsidiary Crystal Growing Systems has delivered its vertical gradient furnace (VGF) production plant to Freiberger Compound Materials.
Thursday 17th June 2004
Ultratech introduced the LSA100 laser spike anneal system - the first tool built on the company's new Unity Platform for laser and lithography applications.
Thursday 17th June 2004
ST Assembly Test Services (STATS) announced lead-free and "green" material options for its entire package portfolio.
Thursday 17th June 2004
NanoPierce Technologies signed an exclusive marketing agreement with German companies ExypnoTech GmbH and TagStar Systems.
Thursday 17th June 2004
Renesas Technology has decided to close its European manufacturing subsidiary Renesas Semiconductor Europe (Alsdorf) in Germany.
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Thursday 17th June 2004
SEMI reports semiconductor equipment billings at $9.14bn in Q1 2004, a 65% increase on Q1 2003. Bookings were $9.60bn, up 118%.
Thursday 17th June 2004
SOPRA signed an exclusive license agreement for IMEC's patented ellipsometric porosimetry (EP) technology.
Tuesday 15th June 2004
Infineon Technologies formally opened the second module of its memory chip assembly, package and test facility in Portugal. The company is investing a total of EUR230mn in the new module at the Vila do Condo site.
Tuesday 15th June 2004
NanoPierce Technologies signed an exclusive marketing agreement with German companies ExypnoTech GmbH and TagStar Systems.
Tuesday 15th June 2004
Intel has begun 300mm wafer processing at its Fab 24 in Leixlip, Ireland. In addition, the $2bn facility features Intel's leading 90nm process technology. Fab 24 is the company's fourth 300mm manufacturing facility and Intel's third fab to manufacture semiconductors with 90nm circuitry.
Monday 14th June 2004
The US Semiconductor Industry Association (SIA) has revised its predictions with a compound annual growth rate (CAGR) of 10.4% through to 2007.
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Monday 14th June 2004
Elpida Memory and its Hiroshima subsidiary have started construction on a second 300mm wafer fabrication facility.
Monday 14th June 2004
International Sematech will charter the semiconductor metrology systems division of Carl Zeiss SMT to design and develop a next-generation of the proprietary Aerial Image Measurement System (AIMS) for defect review of 193nm immersion lithography photomasks.
Monday 14th June 2004
Mitsubishi Electric will be using thermal accelerometers from MEMSIC in a handset design for Vodafone Japan.
Monday 14th June 2004
R&D spending in the semiconductor industry is set to reach a record high in 2004, according to European electronics analyst Future Horizons.
Monday 14th June 2004
Toshiba has launched the industry's first commercial system-on-chip (SoC) devices built on the X Architecture design based on the inclusion of diagonal chip interconnects alongside the more traditional right angle wiring.
Monday 14th June 2004
Cambridge University spin-off Cavendish Kinetics claims a major new technology that offers the lowest power and entry-cost embedded non-volatile memory (NVM) in the industry.
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Monday 14th June 2004
A new GBP2mn nanotechnology research laboratory at the University of Bath has been formally opened.
Monday 14th June 2004
austriamicrosystems expanded its 0.35micron foundry technology portfolio with an advanced CMOS opto process.
Monday 14th June 2004
TSMC's chief technology officer, Dr Chenming Hu, is to resign on July 20, 2004, in order to resume his academic career.
Friday 11th June 2004
Cambridge University spin-off Cavendish Kinetics claims a major new technology that offers the lowest power and entry-cost embedded non-volatile memory (NVM) in the industry.
Friday 11th June 2004
ICOS Vision Systems in Belgium has acquired the wafer inspection business of Siemens. Under the terms of the agreement, ICOS acquired for EUR6.25mn cash the rights to all of Siemens' two dimensional (2D) wafer inspection technology as well as related assets. The acquisition was closed on June 8, 2004.
Friday 11th June 2004
austriamicrosystems expanded its 0.35micron foundry technology portfolio with an advanced CMOS opto process. The image sensor technology offers high optical sensitivity and very low dark currents, the company says. The company believes the product could be used in digital video cameras.

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