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Wednesday 26th May 2004
UMC claims a new engineering technique enhances silicon-on-insulator (SOI) transistor performance.
Wednesday 26th May 2004
Surface Technology Systems (STS) and Jobin Yvon report successful completion of first phase tests on a system for in-situ process control of deep silicon etch applications in MEMS manufacturing.
Wednesday 26th May 2004
Intel disclosed plans for an additional $2bn investment in its facilities in Ireland under an agreement with the Irish Development Authority (IDA).
Wednesday 26th May 2004
Tokyo Electron is to restructure its US operations by creating a new holding company named Tokyo Electron US Holdings Inc.
Wednesday 26th May 2004
RF Micro Devices (RFMD) has completed the acquisition of Silicon Wave, a supplier of Bluetooth solutions for wireless personal area networks (WPANs).
Wednesday 26th May 2004
Intersil has selected AMI Semiconductor's mixed-signal process with electrically erasable (EE) memory and 20V capability as part of its second source requirements.
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Wednesday 26th May 2004
Overheating is VLSI Research's fear, after reporting its April 2004 assessment.
Wednesday 26th May 2004
Applied Materials reports FQ2 2004 net sales at $2.02bn, an 82% increase from FQ2 2003's $1.1bn.
Wednesday 26th May 2004
STMicroelectronics, CEA-Leti and Aixtron have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.
Wednesday 26th May 2004
ST Assembly Test Services (STATS) has developed a "Chip Scale Module Package" (CSMP) thin-film technology, which involves the fabrication of passive devices such as resistors, capacitors, inductors, filters, baluns and interconnects directly onto a silicon substrate.
Wednesday 26th May 2004
ST Assembly Test Services (STATS) has expanded its integrated turnkey solutions with design-for-test (DFT) capabilities.
Wednesday 26th May 2004
Eastman Kodak has developed an "always on" plastic display.
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Wednesday 26th May 2004
MOSAID Technologies has filed a proposed Stipulated Order of Dismissal for all infringement claims with respect to US patent No.6,067,272 covering a delay locked loop (DLL) circuit for use in synchronous DRAM.
Thursday 20th May 2004
Intel disclosed plans for an additional $2bn investment in its facilities in Ireland under an agreement with the Irish Development Authority (IDA). The deal includes grants and other potential incentives as Intel continues to invest in Ireland. The company's 2004 capital expenditure forecast range of $3.6-4.0bn will accommodate the spending for the early stages of the new project.
Thursday 20th May 2004
Trikon Technologies reports that a number of DRAM manufacturers are evaluating its patented Flowfill and low-k Flowfill inter-metal dielectric gap-fill technologies for sub-90nm device production.
Wednesday 19th May 2004
UMC claims a significant performance enhancement on 45nm p-channel transistors through substrate engineering. UMC's engineers have implemented a new substrate crystalline orientation scheme to realise a transistor drive current increase of 30%, compared to devices fabricated on silicon substrates with conventional surface orientation. Performance gain is based on the same level of device leakage.
Wednesday 19th May 2004
AMD held the "topping-off" ceremony for its next-generation 300mm manufacturing facility, AMD Fab 36, in Dresden, Germany.
Wednesday 19th May 2004
Coventry University Enterprises is seeking industrial partners and licencees for silicon technologies developed at the UK university.
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Wednesday 19th May 2004
austriamicrosystems has completed its Swiss stock exchange listing following its initial public offering (IPO).
Tuesday 18th May 2004
OSRAM Opto Semiconductors has been named the exclusive worldwide organic light-emitting diode (OLED) supplier for Cyclotec AMT, a supplier of medical technology.
Tuesday 18th May 2004
European IC producer Micronas has agreed to acquire LINX Electronics, a US fabless semiconductor company that develops digital television solutions for improved reception of high-definition television (HDTV) signals.
Tuesday 18th May 2004
Coventry University Enterprises is seeking industrial partners and licencees for silicon technologies developed at the UK university.
Tuesday 18th May 2004
A small German company is seeking partners for a chip stacking technology for memory modules through the Wirtschaftsförderung Berlin International business development organisation.
Tuesday 18th May 2004
A new generation of programmable CMOS imaging chips is to be developed in a project led by University of Sheffield Professor Nigel Allinson. Among the hopes for the GBP4.5mn MI-3 project are the earlier detection of cancer, the instant analysis of medical screening tests and the ability for emergency and security services to work effectively in murky surroundings. Possible scientific applications are seen in studies of the fundamental interactions of matter, space exploration and cell biology.

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