Motorola subsidiary Freescale Semiconductor has introduced four new high-performance general-purpose amplifiers (GPAs) designed for a broad range of Class A, small-signal, high linearity radio frequency (RF) applications.
Motorola's Freescale Semiconductor subsidiary/spin-out preparation vehicle has joined the effort of European companies STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging.
Delft Technical University's lab-on-chip development has achieved commercial success with US bio-technology company WaferGen planning to produce three micro laboratories on three different sensor chips developed from the Dutch research.
SUSS MicroTec claims installation of the world's first 300mm semiautomatic cryogenic probe system capable of DC testing down to 100femtoA at temperatures from 400K(127degreeC) down to 30K (-243degreeC) at a “leading semiconductor manufacturer”.
PVA TePla in Germany has signed an asset deal to acquire the Floatzone Equipment business unit from Haldor Topsoe based in Denmark. The seller is withdrawing from floatzone activities in order to concentrate on its core business.
austriamicrosystems claims the world's smallest 10-bit multiple output magnetic rotary encoder IC, the AS5040. The system-on-chip integrates field sensing Hall elements, analogue front-end and digital signal processing in a single device.
Cadence Design Systems and ASML MaskTools announced a multi-year, multi-million dollar software licensing and joint development agreement for advanced resolution enhancement technology (RET) software solutions. The two companies will work together to develop a tightly integrated design for manufacturability (DFM) flow.
Delft Technical University’s lab-on-chip development has achieved commercial success with US bio-technology company WaferGen planning to produce three micro laboratories on three different sensor chips developed from the Dutch research. WaferGen will acquire licences for the patented design. In return for the licences, TU Delft will receive royalties and shares in the US company.
International SEMATECH in the USA and Exitech in the UK have announced an agreement to develop the world's first ultra high numerical aperture (NA=1.3) 193nm wavelength immersion lithography tool. The MS 193I development tool will be used to speed the development of critical infrastructure for immersion lithography at SEMATECH's Immersion Technology Center in Austin, Texas.
MotorolaÕs Freescale Semiconductor subsidiary/spin-out preparation vehicle has joined the effort of European companies STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly package technologies.
eASIC has taped out its first structured ASIC array to be fabricated by a European integrated device manufacturer (IDM) partner on a 0.13micron process. The taped-out array called FA1 is the smallest member of the company's Structured eASIC product family. The initial parts will be used to characterise timing and power for the structured ASIC fabric and cell libraries.
Novellus Systems has agreed to acquire Peter Wolters, a manufacturer of high-precision machine manufacturing tools headquartered in Rendsburg, Germany. The deal brings a chemical mechanical planarisation (CMP) product line (particularly tungsten and dielectric) to add to NovellusÕ existing CMP technology for semiconductor manufacturing. The acquisition is expected to close in the beginning Q3 2004. Novellus acquired CMP tool producer SpeedFam-IPEC in 2002.