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Thursday 13th November 2003
EV Group (EVG) has successfully installed an EVG501 wafer bonding system and an EVG620 precision alignment system for double-side lithography at McGill University’s Nanotool Micromachining fab in Montreal, Quebec, Canada.
Thursday 13th November 2003
Researchers at Motorola's semiconductor labs have built a "Multiple Independent Gate Field Effect Transistor" (MIGFET). The device allows for one transistor to contain multiple independent gates. Motorola claims it as a "first-of-its-kind". The company believes that the transistor could provide a major boost to the continuing drive toward smaller, more powerful chips.
Thursday 13th November 2003
Researcher Carlos Gonzalez from the Department of New Materials at CIDETEC (Basque Country, Spain) has developed a cosmetic false nail that can change colour.
Thursday 13th November 2003
Intel says that it has identified new materials as high-k gate dielectric and gate metal to replace those used to manufacture chips for more than 30 years. Intel says that the new high-k material reduces leakage by more than 100 times over silicon dioxide.
Friday 7th November 2003
TRONIC’S Microsystems, a developmer and producer of custom MEMS (Micro Electro Mechanical Systems) for high-end applications, today held the inauguration of its new state-of-the-art MEMS production facility in Crolles, France. The company is enhancing its production capacity of high performance, high value add custom MEMS products based on specialized thick silicon-on-insulator (SOI) micromachining processes.
Friday 7th November 2003
The Semiconductor Industry Association (SIA) has released its annual forecast for 2003-2006, highlighting a strong growth forecast for 2004.
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Friday 7th November 2003
Agere Systems has announced it has produced the fastest working high-speed serial interface circuits in 90 nm low-k technology. Agere's 90nm serialiser/deserialiser (SerDes) technology will enable speeds of 12 gigabits per second (Gbits/s), 20 percent faster than currently available technology.
Friday 7th November 2003
IQE, an outsource supplier of advanced wafers to the semiconductor industry, has announced the successful completion of a Placing and Open offer, raising £18.75 million (£17.9 million net of expenses).
Friday 7th November 2003
The worldwide semiconductor equipment market has begun its much anticipated albeit small recovery in 2003, according to the report recently published by The Information Network.
Thursday 6th November 2003
West Associates appointed Distributor for Qualiflow in UK & Ireland Whatever you are doing with gases, West Associates probably has a gas handling product that would help. After 12 successful years distributing: · NuPure Point Of Use gas purifiers (sub ppb purity whether it is argon, arsine or ammonia) · Firechek pneumatic shut-off valves (temperature triggered) · Emergency Containment Systems gas cylinder containment vessels · AXT VGF GaAs & InP wafers (2” – 150mm, Semi Insulating or Semi Conducting)) West Associates has now added Qualiflow to the stable, to offer: · Mass Flow Controllers & Meters (digital & analogue) · Liquid Flow Controllers · Vapour Flow Controllers · Bellows valves · Diaphragm valves · Manifolds Qualiflow’s own product range has extended significantly, following their merger with Jipelec and acquisition of a 33% share of Lintec, both leading manufacturers of liquid vaporization systems. Liquid evaporation is thought to be a key technology in the manufacturing of the next generation of integrated circuits. If you have a specific purifier need let us know the details here Purifier RFQ and we will send you the appropriate quotation & data sheet. Otherwise, tell us what you are doing with gas and we’ll keep you updated with the relevant product news click here.
Friday 31st October 2003
EV Group (EVG) and Silicon Genesis (SiGen) announced a wide ranging co-operation in the field of low-temperature wafer bonding based on a license of SiGen's NanoBond patents and process technologies.
Friday 31st October 2003
Tronic’s Microsystems and Sercel presented the results of a strategic partnership for the fabrication of a new generation of seismic sensors, or geophones, based on micro-electro-mechanical system (MEMS) technology. Tronic’s optimised and then industrialised a prototype that was jointly developed by Sercel and the French CEA Leti microelectronics laboratory. Tronic’s has already ensured the first series production of the seismic sensors and is now in volume production.
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Wednesday 29th October 2003
Sony restructuring proposals see semiconductor technology as a "core sector" for the company. Semiconductors will be part of Sony’s "convergence strategy" for home and mobile electronics.
Wednesday 29th October 2003
The Arizona State University (ASU) NanoFab has bought an EVG620 precision alignment system and EVG520HE Hot embossing and wafer bonding system from EV Group (EVG). ASU NanoFab is developing a southwest USA regional centre of excellence. A major research instrumentation award from the US National Science Foundation allows ASU to invest in equipment to enhance the university's capability to create biochips.
Wednesday 29th October 2003
STMicroelectronics has made a joint development agreement with MobiDiag to create a complete system for genomic-based detection of infectious diseases based on a silicon micro-electro-mechanical systems (MEMS) biochip. The system will allow clinical diagnostics laboratories faster, cheaper, and more user-friendly access to genomic-based techniques for infectious disease detection.
Tuesday 28th October 2003
The Auction of State-of-the-Art Optical and Semiconductor Fabrication Tools will include: Thermo VG Semicon V100 HU Molecular Beam Epitaxy System & Semiconductor Fabrication Tools Auction Starts November 12, 2003 at 9:00 AM EET Auction Ends November 12, 2003 at 11:00 PM EET Visit: http://www.dovebid.com/Auctions/AuctionDetail.asp?auctionID=2258&referraltag=cohef Email: patkinson@dovebid.com To participate in this auction log on to www.dovebid.com, register for an account, and start to bid. Once you set up an account, you’re ready to participate in any DoveBid Featured Online Auction! Prior to the auction, preview the assets online via digital photos and comprehensive descriptions. You can also inspect the assets in person in Tampere, Finland. When you find an item you want to bid on, enter your bid amount in the “bid box”, and then monitor your bid as others compete against you. Be sure to click the "refresh" button on your web browser often to keep the bid information on your screen updated. A timer displays how much time is remaining before the lot closes. And when the time runs out, the highest bidder wins! DoveBid sends an immediate email notification to all bidders who win assets.
Tuesday 28th October 2003
Intel gave details of a strained silicon transistor that is being used in its next-generation 90nm process. The process is to be ramped this year at the company’s 300mm fabs in Hillsboro, Oregon, and Albuquerque, New Mexico. And next year (H1 2004), the process will come to Europe at Intel’s fab in Leixlip, Ireland.
Monday 27th October 2003
eupec has opened a new production facility for insulated gate bipolar transistor (IGBT) power semiconductor modules in Cegled, Hungary.
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Monday 27th October 2003
A new method to completely remove SU-8 photoresist from micro structured components has been developed by a team of experts from the Institut fuer Mikrotechnik Mainz (IMM) and the M-O-T Mikro-und Oberflaechentechnik in Germany.
Monday 27th October 2003
EV Group (EVG) has joined an IMEC joint development on wafer-level packaging and micro-electro-mechanical system (MEMS) wafer bonding. EVG also becomes an official partner in IMEC's Industrial Affiliation Program (IIAP) on "wafer-level-packaging on Cu/low-k back-end-of-line" and will supply IMEC with new state-of-the-art mask alignment, spray-coating and wafer bonding tools.
Monday 27th October 2003
Infineon Technologies says that its new LightMOS insulated gate bipolar transistor (IGBT) offers up to 25% annual cost reductions when used in electronic lamp ballasts (ELB) compared with conventional magnetic lamp ballasts.
Monday 27th October 2003
Motorola China Electronics and Semiconductor Manufacturing International Corporation (SMIC) have agreed a long-term, strategic relationship.
Monday 27th October 2003
ASML Optics’ PerfectWave metrology standard enables reliable measurement of dimensions approaching the atomic scale. Flatness variation of the disk is just 1nm, or about 10 atomic layers, across its 100mm diameter.
Monday 27th October 2003
MEMSCAP has entered into a definitive agreement to acquire the Grenoble-based company Opsitech in France. The acquired company is a spin-off from the French "Laboratoire d'Electronique et des Technologies de l'Information (LETI)" of the "Commissariat a l'Energie Atomique (CEA)". Opsitech specialises in integrated optics that can be associated with micro-electro-mechanical systems (MEMS).

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