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Monday 9th June 2003
Mykrolis and Nor-Cal Products have entered into a limited strategic cross distribution alliance to provide complementary chamber critical measurement and control technology to the global semiconductor equipment industry.
Monday 9th June 2003
ULM-photonics is sampling its new 850nm Transsub VCSEL laser that operates at 3.125Gbit/sec.
Monday 9th June 2003
German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.
Monday 9th June 2003
A model for the electrical activity of hydrogen in almost any material - semiconductor, insulator and even aqueous solution - has been developed by Chris G Van de Walle of the Palo Alto Research Center (PARC) and J Neugebauer of Berlins Fritz Haber Institut der Max Planck Gesellschaft (Nature, June 5, 2003).
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
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Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Monday 9th June 2003
The Centre for Integrated Circuit & Systems at Singapores Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturings 0.18micron RF CMOS semiconductor process.
Sunday 8th June 2003
Applied Materials says it has produced the industrys first 90nm test chip for X Architecture interconnect designs at its Maydan Technology Center in California.
Sunday 8th June 2003
Motorola reports its first volume shipments of microprocessors produced using a low-k insulating dielectric during its copper metallisation process on 200mm wafers.
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Friday 6th June 2003
MOSAID Technologies has filed an amended answer and counterclaim in its litigation with Infineon Technologies in the Northern District of California.
Friday 6th June 2003
Bookham Technology says it is launching the first European-based commercial processes to use 150mm wafer technology for producing GaAs monolithic microwave ICs (MMICs). Only a handful of foundries world-wide have this capability. Initial production will start in late 2003. The new 150mm wafer process will increase per-wafer device volumes by up to a factor of four.
Thursday 5th June 2003
OptoLum has been awarded a US patent on removing heat from densely packaged LEDs No.6,573,536). The techinque uses one of the fundamental rules of nature on earth – heat rises.
Thursday 5th June 2003
ULM-photonics is sampling its new 850nm Transsub VCSEL laser that operates at 3.125Gbit/sec. The GaAs VCSEL was grown as a bottom emitter with topside P and N contacts.
Thursday 5th June 2003
Wednesday 4th June 2003
Great riches have resulted from the smaller, better, faster electronics that have been made possible by semiconductors over the past half-century. Those who traditionally worked to minaturise electronics are now looking to other applications for new business opportunities. A few have already managed to make new businesses in sensor and other micro system technologies – accelerometers for airbag deployment, inkjet cartridge parts, thin-film heads for hard disks, structures for microphones and so on. Business constellation These new applications move beyond electronics to mechanics, optics, chemistry, biology, electomagnetic field detection . . . The new business – or perhaps more accurately the new constellation of businesses – faces many challenges. These include building new standards and new industrial consortiums and organisations. Technical challenges include finding the most suitable packaging and test strategies for sensitive, delicate devices that must also interact with their environment. Newsletter for a changing world Our new OptoMEM newsletter plans to chronicle these developments and promote the commercialisation of these exciting products. Get in touch for new opportunities Send us your e-mail address to be put on our list. Send us your news. Contact us for marketing opportunities and sponsorship. Sign-up to [email protected] News to [email protected] Sponsorship enquiries to [email protected]
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Wednesday 4th June 2003
German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.
Tuesday 3rd June 2003
Mitsubishis Semiconductor division introduced the ML9xx40 Series of distributed feedback laser diodes (DFB-LD), which enables 2.5Gbps-100km transmission in a 0-85C temperature range. Samples are to be available in June 2003 with mass production scheduled to begin August 2003.
Tuesday 3rd June 2003
Japanese researchers have fabricated transparent field effect transistors (Science, May 23, 2003). The electron channel material used was InGaO3(ZnO)5, a single-crystalline thin-film oxide semiconductor. Amorphous hafinium oxide was used for the insulating gate material. The on-to-off current ration was 1E6 and the field-effect mobility was 80cm2/V/sec at room temperature. Use of such clear transistors is foreseen in optoelectronics.
Tuesday 3rd June 2003
Ellipsiz Engineering Solutions arm has been contracted to supply a total utilities solution to Advanced Semiconductor Manufacturing (ASMC) of Shanghai, China. ASMC is a joint venture foundry between the Chinese government and Philips Electronics. The multi-$mn contract charges the Facilities and Service Business unit of Ellipsiz Engineering Solutions to provide a full range of utilities construction, covering the integration of all process tools for Fab 3, ASMCs new 200mm fab. The facility will be capable of 0.18micron processing. Ellipsiz support will include anticipating and resolving field installation problems, sub-fab sub-unit layout management, hook-up protocol and procedures and post-hook-up services. This is Ellipsiz first facility-based project in China.
Tuesday 3rd June 2003
STMicroelectronics has bought the assets and business of Incard from IPM Group. The transaction between ST and IPM Group includes a cash consideration of EUR75mn for the purchase of Incard. According to Gartner Dataquest, the Italian-based Incard was the sixth largest smartcard maker in the world in 2002 with particular strength in the telecom market. Incard has a manufacturing facility located in Marcianise, Italy. The company has some 290 employees, a large number of whom are technical experts working in R&D, product development and application support. Incard has a wide product range of cards, software and development kits covering several smartcard applications, with a special emphasis on telecom prepaid cards and SIM modules.
Tuesday 3rd June 2003
Austriamicrosystems’ board of directors has approved a capital investment plan to extend the wafer capacity in its new 200mm fab.

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