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Tuesday 1st July 2003
Keithley´s device, component, and circuit characterization solutions combine superior precision and accuracy with exceptional speed and ease of use. For semiconductor reliability testing, Keithley has integrated test solutions for wafer level reliability, accelerated stress, quality assurance, hot carrier degradation, time dependent dielectric breakdown and analysis, and many other general Test&Measurement and Data Acquisition applications, including: · High Performance Single-insertion RF and DC Test Solution · Fast and easy to use single to multi-channel Device Characterization incl. KTE, HCI, IC-CAP software · C-V Measurements · Ethernet-based Switch/Measure systems, SourceMeters, DMMs, Data Acquisition products Contact us for free application advice. Use expert advice from Keithley's team of test experts. For more information about any of our solutions or to discuss your application with one of our experts, call or send a fax or an e-mail to your local Keithley office: Belgium: phone 02-363 00 40, fax 02-362 00 64, e-mail info@keithley.nl Finland: phone 09-53 06 65 60, fax 09-53 06 65 65, e-mail finland@keithley.com France: phone 01-64 53 20 20, fax 01-60 11 77 26, e-mail
Monday 30th June 2003
Ultratech says that it has successfully developed what it believes to be the IC industry's first laser thermal processing (LTP) technology.
Monday 30th June 2003
STMicroelectronics was one of three silicon chip manufacturers to be named in BusinessWeek's "InfoTech 100" annual ranking of top technology companies.
Monday 30th June 2003
Daw Technologies has announced the continuation of long-term maintenance services for the specialist cleanroom facilities at the Scottish Microelectronics Centre (SMC).
Monday 30th June 2003
Praxair and the HC Starck affiliate of Bayer AG have formed an alliance to develop, manufacture and supply colloidal silica slurries for the semiconductor chemical mechanical planarisation (CMP) market.
Monday 30th June 2003
Advantest plans to spin off its information technology department to establish a new, 100% subsidised subsidiary Advantest Information Systems on July 1, 2003.
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Monday 30th June 2003
Semiconductor equipment supplier SCP Global Technologies (SCP) has formally registered its newly-acquired European facility as SCP Germany GmbH.
Monday 30th June 2003
"One of the worlds leading suppliers of office automation equipment" has ordered an Aspen ICP Strip system from Mattson Technology.
Monday 30th June 2003
AMD reduced it sales expectations for Q2, ending June 29, 2003.
Monday 30th June 2003
The Fabless Semiconductor Association (FSA) announced today the results of its quarterly wafer pricing survey.
Monday 30th June 2003
Micronas introduced what it calls "ActivePackage" - aimed at ridding a headache car manufacturers worldwide have shared for many years.
Monday 30th June 2003
IBM has launched a web portal for chip designers and verification engineers that will provide access to select tools on an as-needed basis.
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Friday 27th June 2003
Researchers from Karlruhe (Sciencexpress, June 26, 2003) have developed a method to separate metallic from semiconducting single-walled carbon nanotubes (SWNTs). The technique uses the different relative dielectic constants of the two types of tube with respect to the solvent.
Friday 27th June 2003
Researchers have made progress in producing n-type diamond with high conductivity (Nature Materials, July 2003). Diamond is an attractive material in terms of its electrical, optical thermal and chemical properties. However, creating n-type conduction in the material has been a major challenge. Phosphorus doping has only achieved properties that are unsatisfactory for most device applications.
Friday 27th June 2003
Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.
Friday 27th June 2003
Praxair and the HC Starck affiliate of Bayer AG have formed an alliance to develop, manufacture and supply colloidal silica slurries for the semiconductor chemical mechanical planarisation (CMP) market. The slurries will be marketed and sold globally by Praxair Electronics.
Friday 27th June 2003
Mykrolis has signed a distribution agreement with Zurich-based Levitronix, a manufacturer of pump products for the semiconductor and medical markets.
Friday 27th June 2003
XenICs introduced its new infrared focal plane camera XEVA-USB. This camera has a near-infrared InGaAs imager with a resolution of 320x256pixels. The system is sensitive to radiation of wavelengths between 0.9mm and 1.7mm. This part of the spectrum is fully complementary to the sensitivity range of standard CCD cameras.
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Friday 27th June 2003
Semiconductor equipment supplier SCP Global Technologies (SCP) has formally registered its newly-acquired European facility as SCP Germany GmbH. This brings the Pliezhausen facility in Germany into the corporation.
Friday 27th June 2003
Solar cell panel production is to be developed in Uppsala, Sweden, with the first products coming in five years’ time. An agreement between three major companies, two investment funds, and a spin-off company from the Uppsala University Angstrom Solar Centre will be the launch pad for the new development.
Friday 27th June 2003
Ultratech says that it has successfully developed what it believes to be the IC industrys first laser thermal processing (LTP) technology. The company believes that this will allow manufacturers to scale down to the 20nm technology node. The new technology is the result of nearly nine years of intensive development. LTP uses laser heating, which can be focused at specific areas of the wafer, rather than across the wafer as happens in furnaces or with rapid thermal processing (RTP).
Friday 27th June 2003
Basan has opened basan UK. Basan is a European distributor of cleanroom products and equipment.
Friday 27th June 2003
Daw Technologies has announced the continuation of long-term maintenance services for the specialist cleanroom facilities at the Scottish Microelectronics Centre (SMC). Daw was chosen to build the centre three years ago and has been closely involved with all subsequent expansions.
Friday 27th June 2003
SUSS MicroTec announced new capabilities for cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics.

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