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Wednesday 4th June 2003
German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.
Tuesday 3rd June 2003
Mitsubishis Semiconductor division introduced the ML9xx40 Series of distributed feedback laser diodes (DFB-LD), which enables 2.5Gbps-100km transmission in a 0-85C temperature range. Samples are to be available in June 2003 with mass production scheduled to begin August 2003.
Tuesday 3rd June 2003
Japanese researchers have fabricated transparent field effect transistors (Science, May 23, 2003). The electron channel material used was InGaO3(ZnO)5, a single-crystalline thin-film oxide semiconductor. Amorphous hafinium oxide was used for the insulating gate material. The on-to-off current ration was 1E6 and the field-effect mobility was 80cm2/V/sec at room temperature. Use of such clear transistors is foreseen in optoelectronics.
Tuesday 3rd June 2003
Ellipsiz Engineering Solutions arm has been contracted to supply a total utilities solution to Advanced Semiconductor Manufacturing (ASMC) of Shanghai, China. ASMC is a joint venture foundry between the Chinese government and Philips Electronics. The multi-$mn contract charges the Facilities and Service Business unit of Ellipsiz Engineering Solutions to provide a full range of utilities construction, covering the integration of all process tools for Fab 3, ASMCs new 200mm fab. The facility will be capable of 0.18micron processing. Ellipsiz support will include anticipating and resolving field installation problems, sub-fab sub-unit layout management, hook-up protocol and procedures and post-hook-up services. This is Ellipsiz first facility-based project in China.
Tuesday 3rd June 2003
STMicroelectronics has bought the assets and business of Incard from IPM Group. The transaction between ST and IPM Group includes a cash consideration of EUR75mn for the purchase of Incard. According to Gartner Dataquest, the Italian-based Incard was the sixth largest smartcard maker in the world in 2002 with particular strength in the telecom market. Incard has a manufacturing facility located in Marcianise, Italy. The company has some 290 employees, a large number of whom are technical experts working in R&D, product development and application support. Incard has a wide product range of cards, software and development kits covering several smartcard applications, with a special emphasis on telecom prepaid cards and SIM modules.
Tuesday 3rd June 2003
Austriamicrosystems’ board of directors has approved a capital investment plan to extend the wafer capacity in its new 200mm fab.
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Monday 2nd June 2003
The technical information presented at the SPIE conference in Santa Clara made it clear that the lithography technologists believe they can meet the demands of a roadmap defined by Moores Law. The question that is increasingly required is whether or not current business models can support such technological advancement. David Ridsdale reports.
Monday 2nd June 2003
The technical information presented at the SPIE conference in Santa Clara made it clear that the lithography technologists believe they can meet the demands of a roadmap defined by Moores Law. The question that is increasingly required is whether or not current business models can support such technological advancement. David Ridsdale reports.
Monday 2nd June 2003
The World Semiconductor Trade Statistics organisation reports April 2003 IC sales at $12.1bn, up 9.7% on April 2002.
Monday 2nd June 2003
The Centre for Integrated Circuit & Systems at Singapore’s Nanyang Technological University (NTU) has successfully designed and manufactured a 10GHz voltage control oscillator (VCO) on Singapore foundry Chartered Semiconductor Manufacturing’s 0.18micron RF CMOS semiconductor process.
Monday 2nd June 2003
Innotech has licensed its Threshold Voltage Modulation Image Sensor (VMIS) solid-state image sensor technology to Fujitsu. The Japanese electronics producer already uses CMOS sensors in its portable telephones. Future Fujitsu VMIS-based products are expected to include portable telephones and digital cameras and the traffic and security camera markets as well.
Monday 2nd June 2003
Applied Materials says it has produced the industrys first 90nm test chip for X Architecture interconnect designs at its Maydan Technology Center in California.
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Monday 2nd June 2003
Motorola reports its first volume shipments of microprocessors produced using a low-k insulating dielectric during its copper metallisation process.
Monday 2nd June 2003
Rhetech delivers higher equipment uptime and lower cost of ownership to customers worldwide. Restoration and upgrade programs extend the life of existing Semitool equipment while improving reliability and process performance. Rhetech also sells remanufactured Semitool equipment direct from stock, enabling capacity expansion at a significant cost savings. Rhetech is Semitool’s only authorized supplier of restoration services and remanufactured equipment. Demand the Rhetech Advantage… Click Here to read more...
Thursday 29th May 2003
Atlantic Technology will assemble and package SuperHs latest SH-5, 64-bit CPU test chip into a 456-PBGA package at its facility in Crumlin, South Wales, UK. SuperH will use the test chip for IP validation and benchmarking with its MicroDev modular development platform.
Thursday 29th May 2003
Wacker-Chemie will purchase all the shares from the Wacker NSCE (WNC) joint venture currently owned by Nippon Steel (NSC) by September 30, 2003. NSC owns 45% of the outstanding shares in WNC.
Thursday 29th May 2003
Infineon Technologies’ Munich Research Labs has demonstrated technology for thin encapsulation films (Ta /TaN barrier) that the company believes will meet the needs of metallisation schemes of future chip generations.
Thursday 29th May 2003
Mitsubishi’s Semiconductor division introduced the ML9xx40 Series of distributed feedback laser diodes (DFB-LD), which enables 2.5Gbps-100km transmission in a 0-85C temperature range. Samples are to be available in June 2003 with mass production scheduled to begin August 2003.
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Thursday 29th May 2003
SanDisk has signed a five-year agreement licensing its patents to Olympus Optical covering the xD-Picture Card format.
Tuesday 27th May 2003
Axcelis Technologies introduced a 300mm resist stripping system specifically designed to support the integration of low-k dielectric materials.
Tuesday 27th May 2003
SanDisk has signed a five-year agreement licensing its patents to Olympus Optical covering the xD-Picture Card format. The patents relate to xD flash cards and host devices. SanDisk will in its turn be licensed to manufacture xD-Picture Cards for Olympus as well as sell xD-Picture Cards under the Olympus brand through SanDisks global retail distribution channels. SanDisk will begin shipments of xD-Picture Cards to selected regions beginning in June 2003, with worldwide availability in Q3 2003.
Tuesday 27th May 2003
OIPT has been around for longer than many companies in the Semiconductor market. They were founded in 1981 as Plasma Technology by two engineers from Electrotech. In 1985 they became part of the Oxford Instruments group. Since that time, they have grown within the group, gaining a world-wide reputation for the versatility and long life of their systems. Many university groups are still using early OIPT systems, affectionately known as ‘Orange boxes’. OIPT has always been involved in processing compound semiconductor devices, and this remains a major market today. Despite the global slowdown in communications components, other sectors remain strong, in particular LED manufacture. Other areas of the photonics market are also served, including waveguide and laser fabrication in various materials. OIPT also has experience in processes for manufacturing a range of other optical devices, ranging from micro-lenses to extremely high precision mirrors and filters. This broad range of process experience has provided a good base for MEMS technology. Not only was the original deep silicon etch process developed on an OIPTsystem (at the university of Regensburg), but a wide range of other MEMS fabrication techniques are available and in use around the world. Failure Analysis is another significant process technology available from OIPT, with FA tools being used by many of the largest names in the semiconductor industry. The original OIPT systems were small, open-load systems suitable for R&D. As the processes developed on these systems have matured, so have the systems available from OIPT, so now the small systems are part of a range reaching up to cassette-to-cassette multi-chamber clusters designed for production environments. The range of experience in these and other diverse fields has led many companies and organisations to call OIPT their “Partners in Process”.
Tuesday 27th May 2003
X-FAB Semiconductor Foundries is to expand its production capacity at a 200mm facility in Plymouth, UK. A new wafer stepper is also due to be delivered from ASML.
Tuesday 27th May 2003
Researchers from Kyoto University, Japan, have developed an electochemical technique for extracting silicon from silicon dioxide (Nature Materials, Advance Online Publication, May 18, 2003). Conventionally, SiO2 is reduced to Si by carbothermal reduction. The electrochemical technique involves removing oxygen from SiO2 in a molten calcium carbonate electrolyte at 850C. The carbothermal process is normally carried out at 1700C. Electrochemical reduction in LiCl-KCl-CaCl2 at 500C was also demonstrated. The scientists hope for application of the technique in semiconductor processing and high-purity silicon production.

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