Tronic’s Microsystems and Sercel presented the results of a strategic partnership for the fabrication of a new generation of seismic sensors, or geophones, based on micro-electro-mechanical system (MEMS) technology. Tronic’s optimised and then industrialised a prototype that was jointly developed by Sercel and the French CEA Leti microelectronics laboratory. Tronic’s has already ensured the first series production of the seismic sensors and is now in volume production.
The Arizona State University (ASU) NanoFab has bought an EVG620 precision alignment system and EVG520HE Hot embossing and wafer bonding system from EV Group (EVG). ASU NanoFab is developing a southwest USA regional centre of excellence. A major research instrumentation award from the US National Science Foundation allows ASU to invest in equipment to enhance the university's capability to create biochips.
STMicroelectronics has made a joint development agreement with MobiDiag to create a complete system for genomic-based detection of infectious diseases based on a silicon micro-electro-mechanical systems (MEMS) biochip. The system will allow clinical diagnostics laboratories faster, cheaper, and more user-friendly access to genomic-based techniques for infectious disease detection.
The Auction of State-of-the-Art Optical and Semiconductor Fabrication Tools will include: Thermo VG Semicon V100 HU Molecular Beam Epitaxy System & Semiconductor Fabrication Tools
Auction Starts November 12, 2003 at 9:00 AM EET
Auction Ends November 12, 2003 at 11:00 PM EET
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Intel gave details of a strained silicon transistor that is being used in its next-generation 90nm process. The process is to be ramped this year at the company’s 300mm fabs in Hillsboro, Oregon, and Albuquerque, New Mexico. And next year (H1 2004), the process will come to Europe at Intel’s fab in Leixlip, Ireland.
A new method to completely remove SU-8 photoresist from micro structured components has been developed by a team of experts from the Institut fuer Mikrotechnik Mainz (IMM) and the M-O-T Mikro-und Oberflaechentechnik in Germany.
EV Group (EVG) has joined an IMEC joint development on wafer-level packaging and micro-electro-mechanical system (MEMS) wafer bonding. EVG also becomes an official partner in IMEC's Industrial Affiliation Program (IIAP) on "wafer-level-packaging on Cu/low-k back-end-of-line" and will supply IMEC with new state-of-the-art mask alignment, spray-coating and wafer bonding tools.
Infineon Technologies says that its new LightMOS insulated gate bipolar transistor (IGBT) offers up to 25% annual cost reductions when used in electronic lamp ballasts (ELB) compared with conventional magnetic lamp ballasts.
ASML Optics’ PerfectWave metrology standard enables reliable measurement of dimensions approaching the atomic scale. Flatness variation of the disk is just 1nm, or about 10 atomic layers, across its 100mm diameter.
MEMSCAP has entered into a definitive agreement to acquire the Grenoble-based company Opsitech in France. The acquired company is a spin-off from the French "Laboratoire d'Electronique et des Technologies de l'Information (LETI)" of the "Commissariat a l'Energie Atomique (CEA)". Opsitech specialises in integrated optics that can be associated with micro-electro-mechanical systems (MEMS).
Maxim Integrated Products has bought Philips’ 200mm semiconductor wafer fabrication facility in San Antonio, Texas. Maxim believes that the facility is capable of producing revenues of $500 million per year. The purchase price for the campus, facility, and all equipment is $40mn.
Infineon Technologies is to outsource payroll accounting, major parts of recruitment and student intern hosting in Germany and Austria. The company taking up these activities for Infineon is EDS of Russelsheim, Germany.
Infineon, Intel, Philips, Samsung Electronics and STMicroelectronics have joined IMEC’s new sub-45nm research platform as "core partners". IMEC has a target of eight to ten core partners in all. The work will involve use of IMEC’s 300mm "research foundry" facility currently under construction.
Omron has developed a front-light manufacturing technology designed to create brighter, clearer liquid crystal display (LCD) screens while reducing power consumption. The technique is based on a hybrid integration of a nano prism array (200nm) with a micro prism array (3microns). The key parameters for screen lighting are low power consumption, brightness and contrast. The technique achieves a three-fold improvement in contrast ratio compared with front lights manufactured by other companies, says Omron.
STMicroelectronics’ Discretes and Standard ICs Group (DSG) plans to advise and provide technical support to Carsem in development of copper clip interconnects for Micro Leadframe Packages (MLPs), under a memorandum of understanding between the companies.
BAOBERLIN in Germany has developed a high power light emitting diode (HL-LED). The company says that the device generates 20 times higher light output because currents reach 600mA rather than the 30mA typical with 2.8x3.2mm2 formats.
SUSS MicroTec has developed a method of plasma surface activation and wafer to wafer bonding for silicon on insulator (SOI) and strained silicon applications. nano PREP reduces the process temperature to 200C allowing new applications for wafer level integration of CMOS and micro-electro-mechanical systems (MEMS) or CMOS and nanotechnology. The technology uses atmospheric pressure plasma to generate a molecular level surface modification to enable the low temperature bonding.