Info
Info
News search:

< Page of 417 >

News


Thursday 4th September 2003
OSRAM Opto Semiconductors introduced blue thin-film LEDs based on its indium gallium nitride ThinGaN technology.
Thursday 4th September 2003
KLA-Tencor and Carl Zeiss Microelectronic Systems have established an alliance on next-generation photomasks for the 90nm and below technology nodes. The joint-development is aimed at providing the most comprehensive and cost-effective solution available to detect, review and disposition defects on advanced reticles. The companies plan to fully integrate reticle inspection, testing, metrology, review and defect dispositioning.
Wednesday 3rd September 2003
The Electromagnetics Laboratory (ITHE) of the Rheinisch Westfaelische Technische Hochschule (RWTH) Aachen has ordered an Aixtron AIX 200/4 RF-S system to research gallium nitride on silicon applications.
Tuesday 2nd September 2003
Hynix Semiconductor says that it is in talks aimed at selling its non-memory business to US financiers Citigroup. By selling non-core businesses to reduce crippling debt and losses, Hynix hopes to stave off bankruptcy. Citigroup has signed a letter of intent to buy the operation, according to Hynix. The non-memory business unit accounts for about 20% of sales.
Tuesday 2nd September 2003
austriamicrosystems has won a multi-$mn contract to design and supply an embedded processor with ultra low-power analogue ICs from Philips Oral Healthcare, a subsidiary of Philips. The application specific integrated circuit (ASIC) will be used in Philips Oral Healthcare’s next generation of Sonicare toothbrush.
Tuesday 2nd September 2003
Chinese foundry services company CSMC Technologies has entered into an arrangement with Chartered Semiconductor Manufacturing for equipment purchase, technology licensing, operational assistance and customer referrals. In return, Chartered will receive cash payments and an equity stake in the Chinese foundry currently specialising in 150mm wafer production.
Info
Friday 29th August 2003
European microsystem supplier MEMSCAP has entered into definitive agreement to acquire GalayOr and to concurrently increase its share capital by cash from financial investors.
Wednesday 27th August 2003
Infineon Technologies has shipped the first samples of its 1Gbit double data rate (DDR) Synchronous DRAM (SDRAM) to key customers. The devices are fabricated using the company's 110nm CMOS process resulting in a chip of area 160mm2 – claimed as the industry's smallest to date.
Wednesday 27th August 2003
ASM International intends to enter into a long-term co-operative agreement with the University of Helsinki to jointly develop atomic layer deposition (ALD) technology. At the same time, staffing at ASM’s Finnish subsidiary will be reduced by about 20 to 25 people as part of earlier announced restructuring plans of ASM's front-end operations.
Wednesday 20th August 2003
Philips Electronics is licensing Memory Stick technology from Sony. Philips will use the technology in its Nexperia portfolio of programmable silicon on chip (SOC) and system solutions for multimedia applications.
Wednesday 20th August 2003
SIGMA-C has added liquid immersion process support to its SOLID-C 6.2 lithography simulation software. The German company began shipping SOLID-C 6.2 in July 2003.
Tuesday 19th August 2003
Infineon Technologies and United Epitaxy (UEC) of Taiwan are to set up a joint venture for the manufacturing and development of fibre optic components.
Info
Tuesday 19th August 2003
STMicroelectronics is using WaferMasters' SAO-150AP stacked annealing oven at its AG-1 wafer fab in Agrate, Italy. The tool is being used on a volume spin on glass (SOG) process.
Tuesday 19th August 2003
Tecan Components says that it is experiencing "significant interest" in its electroformed parts for micro-applications.
Tuesday 19th August 2003
Oxford University's Isis organisation is seeking partners to commercialise research on filling carbon nanotubes with metals and metal compounds. The research comes from Oxford's Department of Inorganic Chemistry.
Tuesday 19th August 2003
Hynix Semiconductor has completed development of its 1Gbit DDR2 memory chip. Sampling will begin in early 4Q 2003 with full-scale volume production coming on-line by early 2004 to coincide with the release of Intel's DDR2 supporting PC chipset.
Tuesday 19th August 2003
STMicroelectronics is using WaferMasters' SAO-150AP stacked annealing oven at its AG-1 wafer fab in Agrate, Italy. The tool is being used on a volume spin on glass (SOG) process.
Tuesday 19th August 2003
Hynix Semiconductor has completed development of its 1Gbit DDR2 memory chip. Sampling will begin in early 4Q 2003 with full-scale volume production coming on-line by early 2004 to coincide with the release of Intel's DDR2 supporting PC chipset. Hynix will use its Golden Chip 0.11micron process technology. A 512Mbit DDR2 chip will also be available.
Info
Monday 18th August 2003
A new operation – Micro Engineering Marketing and Support (M.E.M.S) – has been established to sell maskless photolithography processes and systems in the UK and Ireland. Equipment and support services are also on offer.
Friday 15th August 2003
Infineon Technologies and United Epitaxy (UEC) of Taiwan are to set up a joint venture for the manufacturing and development of fibre optic components. The joint venture will be based within the existing facility of UEC at the Hsinchu Science-based Industrial Park in Taiwan. The new company will be established in October 2003.
Friday 15th August 2003
Oxford University’s Isis organisation is seeking partners to commercialise research on filling carbon nanotubes with metals and metal compounds. The research comes from Oxford's Department of Inorganic Chemistry.
Tuesday 12th August 2003
Reach over 4000 semiconductor suppliers and buyers with your news and product information. Eurosemi e-mail marketing will create your own unique newsletter to be broadcast to our list of industry professionals and your own opt-in e-mail list. Previous examples include: - Saes Getters - Dovebid Click Here for your Free Eurosemi e-mail marketing pack.
Monday 11th August 2003
Genus announced multiple orders for its StrataGem200 atomic layer deposition (ALD) tool from a major European DRAM manufacturer.
Friday 8th August 2003
Tecan Components says that it is experiencing "significant interest" in its electroformed parts for micro-applications.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}