IC Industry Awards Preview

Splitting hairs to ten to the power of four

TANAKA introduces “TK-SK” Palladium alloy for test equipment

Rebellions collaborates on next-gen AI computing chiplet technology

Semiconductor giants add $2.7 trillion to their stock values

Semiconductors: Unstoppable growth in a billion-dollar market

Sustainable cleaning solutions for a greener microelectronics industry

Why the mask world is moving to curvilinear

Beyond AOI: An AI-driven revolution in visual inspection

Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.

Xscape Photonics raises $44 million Series A

CMOS sensors for niche vision applications

Emphasis on AI applications

Promoting collaboration and novel IC design technologies

East Asian manufacturer's metrology must-haves

Infineon intensifies sustainability collaboration

Accelerating semiconductor designs for AI applications

Heidelberg Instruments launches nanolithography tool

SEMIFIVE concludes HyperAccel contract

Nova Prism 2 selected by logic manufacturer

Baya Systems expands through partnership with IPro Silicon IP

SensiML and Efabless partner

How to bring photonic chips to the market faster?

Pfeiffer Vacuum becomes Pfeiffer Vacuum+Fab Solutions

Infineon combines silicon and silicon carbide in an e-mobility power module

Jacobs awarded CG Semi contract

Klika Tech joins Nordic Semiconductor Partner Program

Experts warn UK semiconductor firms are at risk from global trade war

Seoul Semiconductor illuminates its wired and wireless networking experience

Amkor and TSMC to expand partnership

Visualisation first for UC Santa Barbara

Plurilock achieves US$1.7 million cybersecurity sale

SIAE MICROELETTRONICA selects EnSilica