+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Introducing the N-332 - Vacuum Compatible Nanopositioning Stage family

News

Compact stage design with self-clamping motor is ideal for UHV applications.

PI’s new N-332 nanometer-precision linear stage family, configurable to multi-axis setups of XY, XZ and XYZ, is designed for high-end applications in semiconductor technology, fiber-optics, microscopy, bio-nanotechnology, metrology and scientific research in beamlines and laser labs. The stages have a low profile of 30mm and a small footprint of 80x110mm an 80x160mm with travel ranges of 1” and 2”, respectively.

No Brake or Counterbalance Required

Due to the high active force of 75N and power-off passive holding force of 80N, the N-332 nanopositioning stage does not require a brake or counterbalance when operated in vertical orientation.

UHV-Option

For demanding applications that require operation in high vacuum, N-332 stages are available in configurations suitable for pressures down to 10-9 hPa. The self-clamping nature of the piezo motor allows the stage to hold a position without heat generation.

PICMA-Walk Technology – High Force and High Resolution

The PICMA-Walk piezo motor inside the N-332 stage is based on 4 pairs of PI’s proprietary PICMA® piezo actuators, arranged in a V8 configuration. PICMA piezo actuators were successfully tested for 100 billion cycles by NASA/JPL before being used on the Mars Rover’s instrumentation lab. PICMA-Walk motors provide high force linear motion to 75N and are capable of sub-nanometer resolution and self-locking when de-energized – a great advantage for applications where a stable position must be maintained without power, heat generation or servo jitter.

Advantest celebrates 25th anniversary of V93000 SoC Test Platform
Advanced packaging in Europe: Swissbit hosts EuroPAT Workshop 2024
Introducing the N-332 - Vacuum Compatible Nanopositioning Stage family
ACM Research strengthens its fan-out panel level packaging portfolio
Imec demonstrates logic and DRAM structures using High NA EUV Lithography
Yongjiang Laboratory orders Reactive Ion Beam Trimming equipment from scia Systems
Paving the way for the semiconductor future
Government scheme helps UK chip start-ups raise £10 million
Renesas completes acquisition of Altium
Greene Tweed highlights Chemraz 541
Intel acts to 'accelerate progress'
Infineon reports slight increase in revenue and earnings in Q3 FY 2024
New partnership brings semiconductor manufacturing to Central Valley
Merck joins German research project "Semiconductor-X"
V-Nova and Amlogic form partnership
AMI joins NXP Semiconductors Partner Program
EFC Gases & Advanced Materials announces $210 million investment
Promex Industries and QP Technologies implement sales/marketing reorganisation
Amkor signs preliminary Memorandum of Terms with US Department of Commerce
Ansys 2024 R2 delivers multiphysics innovation
Infineon introduces Edge AI evaluation kit
Nearfield Instruments to supply QUADRA Metrology System to Asian fab
ACM Research enters Fan-out Panel Level Packaging market
Nanotronics unveils nSpec ES
Samsung Electro-Mechanics collaborates with AMD
3D-Micromac receives laser-trimming system order from Infineon
Agile Analog delivers customisable IP on GlobalFoundries’ FinFet and FDX processes
Development of a fully digitised biological world
SkyWater invests in MEBL
Adeia enters into hybrid bonding agreement with Hamamatsu Photonics
Biden-Harris Administration unveils preliminary terms with GlobalWafers
UK-India Technology Security Initiative launches in New Delhi
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: