Loading...
News Article

Tower Semiconductor releases 300mm silicon photonics process

News

Featuring 'industry-leading' figures of merit addressing the evolving needs for next-generation datacom applications.

Tower Semiconductor has released its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering. This advanced process complements Tower's well-established 200mm (PH18) platform that is in high-volume production today, providing its customers with a cutting-edge solution tailored to meet the growing needs of high-speed data communications for next generation datacom applications.

The unique 300mm offering features best-in-class silicon waveguides and the most advanced low-loss silicon nitride waveguide offerings in the industry. The larger wafer size enhances compatibility with industry-standard OSAT (Outsourced Semiconductor Assembly and Test) platforms, facilitating seamless integration with electronic components and improving overall efficiency.

"We are proud to introduce our new, highly advanced Silicon Photonics offering, which provides a seamless path for our existing customers to transition to next-generation technology on 300mm wafers,” said Dr. Edward Preisler, Vice President and General Manager of RF Business Unit. “This process builds on Tower’s industry-leading 200mm SiPho platform both in terms of continuous process enhancements and increasing flexibility of supply for our customers."

Tower Semiconductor releases 300mm silicon photonics process
3D Semiconductor Packaging market to achieve USD 57.19 bn by 2034
Toshiba releases high-speed photorelay for semiconductor testers
Advantest introduces Advanced Power Multiplexer for V93000 EXA Scale Test Platform
Flash in space
AlixLabs awarded 345,000€
Keysight introduces Electronic Design Automation Software Suite
Q.ANT launches commercial photonic processor
Keysight enables Samsung Electronics
RED Semiconductor chosen for Silicon Catalyst Semiconductor Incubator
Infineon and Quantinuum partner to accelerate quantum computing
Electrification and autonomy: a semiconductor content boost to $1,000 per car by 2029
TechWorks appoints Jillian Hughes as Head of Semiconductors
Merck and Intel launch Academic Research Program in Europe
ventureLAB and Hudson Valley FastFab Inc. sign MOU
Boston Materials reveals $13.5m in new funding
Arteris and MIPS partner
Critical Manufacturing and Red Hat collaborate
Professors from Georgia Tech and University of Michigan to be honoured
Orca Semiconductor enables Industry 4.0 applications
EdgeCortix receives four billion yen subsidy
Park Systems India forms strategic partnership with Labindia Instruments
Renesas unveils automotive multi-domain SoC built with 3-nm process technology
Delivering advanced integration for EV E-Axles
Global semiconductor sales increase 23.2%
Swift Navigation collaborates with Sony Semiconductor Solutions
IonQ to work with imec
EBARA Precision Machinery Europe launches vacuum pump series
Advantest showcases latest test solutions
Agileo Automation launches the E84 PIO Box
Nordic Semiconductor launches next-generation wireless SoCs
Physik Instrumente expands electronics manufacturing in Rosenheim
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: