Loading...
News Article

DeepSeek-R1 1.5B on SiMa.ai for less than 10 watts

News

Secure and private on-device deployment at the Edge with MLSoC Modalix.

SiMa.ai has announced the successful implementation of DeepSeek-R1-Distill-Qwen-1.5B on its ONE Platform for Edge AI, achieving breakthrough performance within an unprecedented power envelope of under 10 watts. This implementation marks a significant advancement in efficient, secure edge AI deployment.

The implementation is powered by the SiMa.ai ONE Platform with the MLSoC Modalix and Palette software, which demonstrates the exceptional responsiveness with Time to First Token (TTFT) as low as a few milliseconds, scaling efficiently based on query complexity. This performance metric positions SiMa.ai at the forefront of enabling conversational AI and multi-modal reasoning in real-world embedded edge AI applications where rapid response times are crucial.

“The availability of industry-leading open source models like DeepSeek R1 or Llama has democratized AI and accelerated the ability to deploy GenAI at the Edge,” said Krishna Rangasayee, CEO and founder of SiMa.ai. “SiMa.ai is leading this revolution in achieving this level of performance, completely at the edge, while maintaining a power envelope under 10W, opening new possibilities for secure, efficient AI deployment. SiMa.ai’s purpose-built MLSoC Modalix now enables multi-modal and high reasoning AI capabilities into diverse markets including robotics, automotive, medical, smart vision, and aerospace and defense applications.”

Details of this implementation include:

• DeepSeek-R1-Distill-Qwen-1.5B with industry-leading power efficiency at under 10W

• Rapid response times with TTFT ranging from 0.67 to 2.50 seconds with 32 input token size and 1028 output token size with room for optimization

• Optimization roadmap to extend performance to >30 Tokens per second (TPS)

Operating completely at the edge ensures that the user retains autonomy over their data while benefiting from high-performance AI capabilities at low power. This approach eliminates common security and privacy vulnerabilities typically seen with cloud deployments.

Organizations interested in learning more about the SiMa.ai ONE Platform and the DeepSeek R1 implementation can join the Modalix Early Access Program to explore our roadmap for LLMs and Generative AI solutions. To get started, visit https://sima.ai/modalix-eap/.

Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning
Svein-Egil Nielsen joins Nanopower as chair of the board
Salience Labs closes Series A Round
Automated electronics disassembly
MESI 4.0 Summit 2025: Global manufacturers reunite to accelerate digital transformation
Thalia introduces latest version of AMALIA
VyperCore launches VyperLab
NXP to acquire edge AI pioneer Kinara
DeepSeek-R1 1.5B on SiMa.ai for less than 10 watts
Arteris releases the latest generation of Magillem Registers
Baya Systems and Semidynamics collaborate
ams OSRAM receives EU Commission approval for investment grant
Q.ANT and IMS CHIPS launch production of high-performance AI chips
SEMICON Southeast Asia 2025 celebrates 30 years of innovation through collaboration
EMEA Big Data Analytics to hit $5,756.5 million by 2027
3D Semiconductor Packaging market to reach US$ 43.6 billion by 2034
Pfeiffer Vacuum+Fab Solutions achieves validation of emission reduction targets by the SBTi
Infineon introduces CoolGaN G3 Transistor
PDF Solutions to acquire secureWISE
Lumotive raises $45 million
Chip-based system for terahertz waves could enable more efficient, sensitive electronics
New Toshiba high-speed photorelays improve semiconductor tester efficiency
Advantest introduces SiConic
STMicroelectronics to enable higher-performance cloud optical interconnect in datacentres and AI clusters
Infineon receives approval for funding under the EU Chips Act
Commission approves €920 million German State aid measure to support Infineon
Texas CHIPS Act awards Silicon Labs $23 million
Advantest Introduces SiConic: Groundbreaking Solution for Automated Silicon Validation
Park Systems Expands FX Large Sample AFM Lineup to Power Next-Gen Industrial Innovation
Lam Research ushers in new era of semiconductor metallisation
Lam Research unveils 'most advanced' Conductor Etch Technology
Pfeiffer Vacuum+Fab Solutions presents the new HiScroll 46
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Adblocker Detected
Please consider unblocking adverts on this website