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Thursday 1st June 2017
WorleyParsons China wins engineering design contract for major polysilicon manufacturer
Thursday 1st June 2017
Brewer Science celebrates 10 years of collaborative research and development with JVIC
Thursday 1st June 2017
Hitachi High-Tech Introduces New Field-Emission Scanning Electron Microscopes
Wednesday 31st May 2017
Mitsubishi Materials completes acquisition of Luvata Special Products
Tuesday 30th May 2017
Imec and Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips
Tuesday 23rd May 2017
GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem
Friday 19th May 2017
LEM launches six new current transducers
Thursday 18th May 2017
Coventor Launches Unified Environment for Designing MEMS for IoT Devices
Thursday 18th May 2017
Sensor sales take off according to IC Insights
Thursday 18th May 2017
Imec and Holst Centre present solution for low-cost eye movement detection
Thursday 18th May 2017
Imec introduces first thin-silicon implantable chip
Wednesday 17th May 2017
D3 Semiconductor announce global distribution agreement with Mouser Electronics
Tuesday 16th May 2017
New gate driver IC targets applications from 400-690 VAC
Tuesday 16th May 2017
Demand for EVG wafer bonding solutions greater than ever
Tuesday 16th May 2017
Gordon Brothers completes financing to SkyWater for purchase of Cypress
Tuesday 16th May 2017
LEM completes surface mounted isolated current transducers range
Tuesday 16th May 2017
Infineon starts volume production of first full-SiC-module
Tuesday 16th May 2017
Imec demonstrates self-learning neuromorphic chip that composes music
Monday 15th May 2017
Pfeiffer Vacuum present leak testing solutions at Interpack and Control
Monday 15th May 2017
STMicroelectronics, IMECAS, and EPOCH cooperate
Friday 12th May 2017
Worldwide tablet shipments decline 8.5 percent
Friday 12th May 2017
600th YXLON X-Ray Inspection System Successfully in Operation
Thursday 11th May 2017
SolarWorld Announce Insolvency
Wednesday 10th May 2017
X-FAB and Exagan successfully produce GaN-on-silicon devices on 200-mm wafers
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