+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Rob Rhoades Joins Revasum as CTO

News

Revasum has announced that Rob Rhoades has been appointed chief technology officer (CTO), effective October 5, 2017.

In his role, Rob will be responsible for overseeing all process development and applications support for Revasum's CMP and grinding products, reporting directly to Jerry Cutini, chief executive officer. "Rob is a tremendously talented and seasoned leader with a proven track record of developing integrated process solutions.His extensive industry experience and strong background in semiconductor technology make him uniquely qualified to take Revasum's technology to the next level," said Jerry Cutini. "We are honored to welcome Rob to the executive team and are confident that he will provide the leadership and vision necessary to help drive excellence throughout the company."

Rob brings over 23 years of experience in developing leading CMP process technology. His expertise includes process engineering, CMP integration, and global applications support for everything from R&D prototypes through volume production on virtually any material. Rob began his career in semiconductors at Motorola in plasma CVD and quickly transitioned to take over responsibility for ramping CMP into production for oxide, tungsten, and STI CMP. Recently, Rob held a number of executive positions including Director of Engineering at Rohm & Haas and CTO at Entrepix, Inc. "The entire semiconductor industry continues evolving at a rapid pace, particularly with regard to CMP, surface finishing, and minimizing form factors. Revasum is ideally positioned in the center of this technology evolution with core strengths across CMP and grinding equipment." said Rob Rhoades

"I am excited and energized to join this great company at the beginning of this next exciting chapter for the industry." Rob has been awarded 12 patents in the areas of process methods, novel materials, and CMP applications. Over his career Rob has published 105 publications and presentations on CMP, including "The Dark Art of CMP". Rob holds a PhD in Electrical Engineering from the University of Illinois, College of Engineering. He is currently on the executive committee for ICPT, the planning team for AVS CMP Users Group, and serves as a lead organizer for the ECS symposium on CMP.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: