Innovative Ion Implant System Offers New Capabilities
IBS, a specialist in ion implant, has announced a new and innovative product known as Flexion again emphasizing continued expertise and value in the world of evolving ion implant applications. This is the first implant system that achieves 400 KeV in a single charge AND simultaneously can implant substrates heated at 600Â°C. This doubles the energy range of the previous IBS system known as the IMC. "This innovation is critical to some emerging applications that need to go above 340 KeV that existing systems have as a limitation." explains Laurent Roux, Founder and President of Ion Beam Services
Flexion systems deliver approximately 20 to 25% higher beam current performance relative to other medium current implanters. Another significant advantage is that Flexion can process a wide range of substrate materials (SiC, HgCdTe, GaAs, GaN, "¦) as well as exotic species such as aluminum or beryllium, required for many rapidly advancing applications like power components and infrared optics.
A First Tool Already Operational In A Research Institute In Beijing
Already meeting the expectations of Chinese Research, the first 400keV tool sold is used to manufacture optoelectronics components. Flexion is specifically well suited to and efficient for this application thanks to the wide range of dopants offered, as well as its capability to cool down to -100Â°C. IBS is becoming a major actor on the Chinese market. IBS also had the breakthrough performed in Asia in Nov 2016 with the IMC tool for the benefit of the Laboratory of the Chinese University Xi'An Jiaotong, ranked 21st in the world.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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