The company will establish its presence in Korea with the opening of a subsidiary to strengthen customer sales, service and support efforts and to augment existing R&D partnerships. Also to increase R&D and high volume manufacturing efforts.
Mattson Technology sets new standard with Alpine new photoresist strip product for BEOL and FEOL. Applications at sub 65 nanometre nodes. Initial system shipped to major semiconductor manufacturer in Taiwan
What is a “Memristor”? And how could it provide better energy efficiency and even get close to the pattern matching capabilities of human brains? The answer could be the fourth missing building block of basic circuits. HP Labs can explain.
Smart Equipment Technology (S.E.T), a supplier of high accuracy Die to Die, Die to Wafer bonding and nanoimprint lithography solutions, announced the successful installation of a KADETT high accuracy placement and bonding system at Cambridge University (UK), department of Engineering.