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Thursday 14th August 2008
Cryptography Research and Infineon Technologies sign license agreement for differential power analysis countermeasures. Joint news release of Infineon Technologies and CRI Technology Media.
Wednesday 13th August 2008
The company reorganises across functional lines and announces management changes.
Wednesday 13th August 2008
The company adjusts profit forecast and goodwill values to reflect changed market conditions.
Wednesday 13th August 2008
Tower Semiconductor & Jazz Technologies announce merger on track for closing in September 2008. Jazz Technologies Stockholders to Vote September 17, 2008. Registration Statement Declared Effective by the SEC.
Wednesday 13th August 2008
The company already distributes Micrel products in North America, Asia and Germany.
Wednesday 13th August 2008
Elke Eckstein joins management team at OSRAM Opto Semiconductors as chief operating officer.
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Wednesday 13th August 2008
The new processes have the funding assistance from the Welsh Assembly Government.
Tuesday 12th August 2008
Engineers and resist suppliers demonstrate CAR platforms that support 22 nm introduction.
Tuesday 12th August 2008
The acquisition continues Ceradyne's vertical integration strategy related to new semiconductor markets.
Tuesday 12th August 2008
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Tuesday 12th August 2008
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Tuesday 12th August 2008
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Tuesday 12th August 2008
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Tuesday 12th August 2008
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Monday 11th August 2008
This deal creates a unique positioning to drive revolution in TV viewing experience.
Monday 11th August 2008
The company advances semiconductor research at UC Berkeley with significant equipment donation.
Friday 8th August 2008
Quantum size effects beneficial for sensor application field and large area displays.
Friday 8th August 2008
The technology targeted at the display driver IC used in high resolution TFT LCD panels.
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Thursday 7th August 2008
New funding sets the stage for high volume manufacturing of thin film thermoelectric devices.
Thursday 7th August 2008
The three companies to set new milestone in establishing wafer level packaging industry standard. The companies team up with advanced packaging provider to jointly develop next generation of eWLB wafer level packaging technology.
Thursday 7th August 2008
Corporate group announces preliminary figures.
Wednesday 6th August 2008
The companies extend their relationship and introduce new and innovative NAND flash memory products and technologies in a bid to help grow NAND businesses.
Wednesday 6th August 2008
Emerging markets like India appear to boost the economy as healthy demands for electronic equipment rises.
Tuesday 5th August 2008
The warning is on short term DRAM market conditions.

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