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Wednesday 27th February 2008
The company becomes an associate member in SEMATECH's 3D Interconnect Programme.
Tuesday 26th February 2008
Board views unsolicited proposal by Japanese company, Sumitomo Heavy Industries and TPG as not in best interests of Axcelis and its shareholders.
Tuesday 26th February 2008
Photomask registration and overlay metrology to enable double patterning lithography.
Tuesday 26th February 2008
A framework contract with module manufacturer Signet Solar has been signed to run until 2011 for the supply of solar modules with a peak output of around 50 megawatt.
Tuesday 26th February 2008
DRAM roadmap to 30nm generation. Step change technology to significantly improve productivity.
Tuesday 26th February 2008
According to a new study by NanoMarkets, materials for use in thin film and organic photovoltaics (PV) will reach $3.8 billion by 2015.
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Tuesday 26th February 2008
Local experts based in the region to support customers of its media rich application processors.
Tuesday 26th February 2008
The company announces a high density array magnetic anomaly sensor development plan.
Tuesday 26th February 2008
Labour saving innovation coupled with outstanding accuracy help improve fuel cell efficiency and reduce costs.
Tuesday 26th February 2008
The two companies sample first 90 nm embedded flash microcontrollers to key automotive customers in a joint effort and declare ‘promise delivered’.
Monday 25th February 2008
IMEC has realised a single-junction GaAs solar cell on a Ge substrate with a record conversion efficiency of 24.7%. The efficiency was measured and confirmed by NREL (National Renewable Energy Laboratory, US). GaAs solar cells are used in satellite solar panels and earth-based solar concentrators.
Monday 25th February 2008
A joint nanotechnology concept, developed by Nokia Research Centre (NRC) and the University of Cambridge (UK), the Morph, was launched.
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Monday 25th February 2008
Materials and process development will target next generation devices for implant solutions.
Monday 25th February 2008
Laser MicroJet to be used for improving solar cell efficiency and reducing overall cost per unit.
Friday 22nd February 2008
DCG Systems enters an agreement with Credence to acquire its diagnostic and characterisation business.
Friday 22nd February 2008
NICTA develops a world first in semiconductor technology for the wireless home and office of the future.
Thursday 21st February 2008
Nikon Corporation announced they will provide an immersion scanner for double patterning based on the successful NSR-S610C platform to their customers in the 4th quarter of 2008.
Thursday 21st February 2008
TSMC joins Sun and Texas Instruments partnership. Companies will combine to design, test and manufacture Sun's 45-nm processors.
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Thursday 21st February 2008
After rolling out the red carpet for software and IT enabled services firms, West Bengal is now wooing the semiconductor industry by offering incentives and concessions.
Thursday 21st February 2008
Berkeley Design Automation’s analogue FastSPICE selected by next generation Japanese supercomputer project for 45nm verification. Tool to verify complex analogue and mixed signal blocks on MDGRAPE-4 project.
Thursday 21st February 2008
Agilent Technologies Inc. announced it has joined the Long Term Evolution/System Architecture Evolution (LTE/SAE) Trial Initiative.
Thursday 21st February 2008
KLA-Tencor announces intent to acquire Belgium's photovoltaic and LED metrology specialist ICOS Vision Systems.
Thursday 21st February 2008
The recently approved EUREKA Cluster for Application and Technology Research on NanoElectronics, CATRENE, announced two new members of management.
Thursday 21st February 2008
Flash memory solutions provider, Spansion, has selected the new RF3S coat/develop track system from Sokudo Co., Ltd to develop 193nm immersion processes for its 32nm Flash devices.

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