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Plasma-Therm and Smoltek to improve chip process technology

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Plasma-Therm and Smoltek have entered a partnership to develop carbon-based growth and device technologies.

Carbon nanofibres (CNF) have been demonstrated as having applications for micro-bumps, enhanced thermal interface material and layer-to-layer micro-vias. Each of these applications addresses important needs in evolving semiconductor chip fabrication and packaging, provides specific advantages over existing technologies, and is CMOS-process compatible.

New applications such as CNF-enhanced electrodes for supercapacitors, on-chip signal filtering capacitors, and antireflective films for optical uses are also emerging as the CNF technology develops.

Over the last 8 years Smoltek has built a strong IP portfolio available for licensing, providing a platform technology to enable controlled growth of substrate-based nanostructures and their related implementation in devices. Uniting withPlasma-Therm, a l= semiconductor plasma processing equipment supplier, R&D efforts will accelerate, and more importantly, begin transferring the technology to an industrial platform.

Abdul Lateef, Plasma-Therm CEO, notes, "This relationship provides an important integration step that inks fundamental material science and device-related structures with an accepted plasma processing platform." He continued, "We are excited to make this investment and commitment in a technology that has such capability to change our industry."

"Working closely at this stage with an equipment supplier is an industrial confirmation of our IPs and enables us to continue to secure development contracts with existing and new customers," comments Anders Johansson, Smoltek CEO. He also notes, "Our CNF-based technology has the potential to open our participation in a variety of very large markets. Having the appropriate processing hardware in this phase is highly valuable."

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