Hesse Dual-Head Wedge Bonder to debut in US
The new Bondjet BJ931L is ideal for lead frame power semiconductor packages
Hesse Mechatronics has revealed the Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder.
The tool enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts.
The Bondjet BJ931L offers:
Compact 1650 mm x 1200 mm footprint
Highest throughput on the market - up to 4500 UPH dependent upon application
Flexibility - Interchangeable bond heads for heavy wire, thin wire, ribbon wire and copper wire.
Patented PiQC analyses each bond in real time to ensure the quality of every device
E-Box optical tool adjustment
"The Bondjet BJ931L enables the fastest throughput available today for power semiconductor packages, and we are pleased to have a machine that directly meets the specific needs of this growing market segment," notes Joseph S. Bubel, President of Hesse Mechatronics, Inc. "We look forward to demonstrating the BJ931L to the international audience at SEMICON West."
Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders, ribbon bonders and complementary equipment for semiconductor backend assembly.
Hesse Mechatronics, Inc., the American subsidiary of Hesse GmbH, will introduce and demonstrate the new Bondjet BJ931L at SEMICON West taking place from July 9th to 11th in San Francisco. The company representatives will be at booth #6081 in the North Hall.
