+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Imec and Renesas unite to revolutionise radios

News

The collaboration will develop robust wireless solutions for future electronics
Imec and Renesas Electronics Corporation have entered into a new strategic research collaboration at Holst Centre.

Together, the companies will collaborate to enhance ultra-low power (ULP) wireless technologies for short range communication, targeting sensor networks for automotive and industrial purposes.

As the newest member of imec's ULP wireless systems program, Renesas will work to jointly develop multi-standard radio solutions for small battery-operated or harvested wireless handheld devices.

By combining innovative architectures, advanced ULP design IP and efficient low power circuits, imec's ULP radios achieve best-in-class performance and reduce power consumption by a factor of 3 to 10 lower than today's radios.

What's more, imec's ULP high-performance radios are compliant with wireless standards, such as Bluetooth Low Energy (2.4GHz band) and ZigBee (2.4GHz band).

"Building on a proven track record of designs, our research program on ULP wireless systems offers great value to our industrial partners. Combining application, circuits and technology know-how, we provide a complete solution, shortening the time-to-market for our industrial partners," says Harmke de Groot, program director ULP wireless technologies at imec/Holst Centre.

"After five years of successful collaboration in our Green Radio program, we are pleased that a prominent semiconductor company as Renesas now joins our ULP wireless systems R&D. We look forward to developing enhanced ULP solutions contributing to the realization of the internet of things in mass market applications," continues de Groot.

"Various applications of sensor networks for a smart society need ultra-low power wireless communication technologies. So we develop innovative RF architectures and circuit technologies for them," says Koichi Yahagi, Senior Manager of 2nd Analogue Core Development Department, Core Technology Business Division, 1st Solution Business Unit, Renesas Electronics Corporation.

"We are pleased to join imec's program to develop new ultra-low power technologies. By combining our Microcontroller units with ultra-low power wireless communication technologies led by this collaboration, we aim to supply solutions for a smart society."

Researchers from Renesas will reside at Holst Centre in Eindhoven, Netherlands, to closely collaborate with imec's research team. Renesas will gain access to imec's years of research in this space.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: