Info
Info
News search:

< Page of 406 >

News


Tuesday 15th May 2007
STATS ChipPAC has announced plans to establish a new research and development (R&D) facility located in Singapore which will be dedicated to developing next generation technology including through silicon via (TSV) and microbump bonding for three dimensional (3D) die, silicon substrate based packaging solutions, and embedded active die technology.
Tuesday 15th May 2007
FSI International has announced that the U.S. Patent and Trademark;Office has awarded the company a patent for a method which produces ultra-uniform etch results in combination with a rinse/dry step in a single immersion tank for front-end-of-line (FEOL) critical cleans
Monday 14th May 2007
austriamicrosystems and NemeriX have announced shipment of the five millionth NemeriX NJ1006A RF IC.
Monday 14th May 2007
Samsung Electronics Co has announced that 21 of its DDR3 solutions have been validated on Intel Corporation's reference platform to work with Intel's next generation DDR3 (Double Data Rate – Version 3) chipsets.
Monday 14th May 2007
IBM has announced plans to redistribute $1 billion per annum across its businesses, mobilising the company's resources in a dramatic attempt to increase the level of energy efficiency in IT.
Monday 14th May 2007
STMicroelectronics has announced that it has shipped over 250 million units of energy-saving products in 2006.
Info
Monday 14th May 2007
Micralyne Inc has announced plans for a partnership with Polychromix to manufacture MEMS near-infrared (NIR) devices for the Polychromix Phazir product line.
Monday 14th May 2007
Asyst Technologies, Inc. announced that its 200mm products have been selected by multiple semiconductor fabs including EM Microelectronic of Switzerland, Shanghai Huahong NEC Electronics Co., (HHNEC) of China and additional semiconductor fabs in China and Russia.
Monday 14th May 2007
Elite Semiconductor Memory Technology Inc., Taiwan (ESMT) and Cypress Semiconductor Corp. have announced a Technology Transfer Agreement under which ESMT will acquire Cypress's Pseudo Static Random Access Memory (PSRAM) product line.
Friday 11th May 2007
Semiconductor Industry Association (SIA) President George Scalise has heralded a bipartisan agreement between the Administration and Members of Congress that will pave the way for progress on key trade opening agreements
Friday 11th May 2007
SUSS MicroTec has announced the official opening of its Application & Measurement Centre in Singapore.
Thursday 10th May 2007
Teridian Semiconductor Corp. celebrated a major company milestone, the shipment of 100 million ICs into cable and satellite digital set-top boxes worldwide.
Info
Thursday 10th May 2007
SMIC (Semiconductor Manufacturing International Company) has signed six Letters of Intent (LOI) outlining plans to purchase semiconductor manufacturing equipment from top American equipment vendors.
Wednesday 9th May 2007
BIOIDENT Technologies Inc has announced its first complete, functional lab-on-a-chip system—the PhotonicFlow System.
Wednesday 9th May 2007
Micronit Microfluidics has introduced four glass microfluidic mixers enabling high-quality mixing of micro or nanoliters of fluids, in fractions of seconds.
Tuesday 8th May 2007
Alereon Inc. has announced the opening of Alereon Semiconductors Pvt., the company's new product oriented research and development (R&D) facility in Pune, India.
Tuesday 8th May 2007
Pall Corporation has filed a patent infringement action against Entegris.
Tuesday 8th May 2007
IC Insights' May update to The McClean Report describes the big shakeup in the 1Q07 top 20 semiconductor supplier ranking. The first quarter inventory correction in the IC industry helped cause a great deal of movement up and down the list in 1Q07 as compared to the full-year 2006 rankings.
Info
Tuesday 8th May 2007
New offices in Singapore and Taiwan will support local ViProbe customers.
Tuesday 8th May 2007
Grundfos, a full-line supplier of pump technology located in Denmark, has purchased, installed and qualified a fully automated Gamma AltaSpray coating cluster from SUSS MicroTec.
Friday 4th May 2007
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.
Thursday 3rd May 2007
RVSI Inspection LLC has announces an agreement between QES and RVSI to represent both Lead Scanner and Wafer Scanner product lines in Singapore, Malaysia, Indonesia and Thailand.
Thursday 3rd May 2007
DLJ Merchant Banking Partners (DLJMB) has announced plans to make a significant investment in Specialized Technology Resources (STR or the Company).;;
Thursday 3rd May 2007
According to a report by Strategy Analytics, the annual five year outlook for the Gallium Arsenide microelectronics industry, "GaAs Industry Forecast: 2006-2011," foretells that this market will enjoy a CAAGR of 12 percent, growing from $3 billion in 2006 to over $5 billion by 2011.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info