Tevet Process Control Technologies has announced that recent and fundamental changes in the semiconductor Chemical Vapour Deposition (CVD) market segment have abruptly created the demand for high speed, every-wafer integrated metrology.
More Moore, an integrated research project funded by the European Commission to promote the development of Extreme Ultra Violet Lithography (EUVL) in Europe, has solved some of the key challenges in the pioneering work of this future semiconductor manufacturing technology.
STMicroelectronics (ST) has announced the decision to deconsolidate its Flash memory business. In this move to further optimise asset utilisation and enhance performance ST will rationalise three of its manufacturing operations.
PULLNANO, a project sponsored by the European Commission within the 6th Framework Program (FP6), has reported several important results related to the future-generation 32nm and 22nm CMOS technology platforms, including the realisation of a functional CMOS SRAM (Static Random Access Memory) demonstrator built using 32nm design rules.
Following the launch of the Risk-Sharing Finance Facility (RSFF), an innovative financing tool to support higher risk financing for projects in the area of research, development and innovation by Janez Potocnik, Commissioner for Research, and Philippe Maystadt, President of the European Investment Bank (EIB), the first operation using the Risk Sharing Finance Facility – RSFF has been signed in Brussels.
A production Laser Annealing System for distribution within Europe has been developed by combining the laser and optics technology of INNOVAVENT with the know how of MACROTRON in semiconductor applications, marketing and system integration technology.
Samsung Electronics Co., has announced that over the past year it has succeeded in introducing more than a half dozen technological advancements that extend battery life in notebooks, MP3 players, digital cameras, video camcorders, multimedia phones and cellular handsets.