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News

News

Tuesday 18th April 2006

New spectrometer generation for light -measurement

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Tuesday 18th April 2006

The Asian Pacific mobile phone market increases by 5.9%

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Tuesday 18th April 2006

Rudolph Technologies announce multiple inspection order

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Tuesday 18th April 2006

TMP and BASF to jointly develop electronic materials

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Tuesday 18th April 2006

Global success for European company

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Thursday 13th April 2006

Henkel announces Asia-Pacific operations

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Thursday 13th April 2006

Optoelectronics sales forecast to surpass discretes in 2006

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Thursday 13th April 2006

Bosch Sensortec expands business into Japan

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Thursday 13th April 2006

Silicon MEMS tech to replace quartz resonators

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Thursday 13th April 2006

TEL delivers new MEMS tester, TEMEON

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Wednesday 12th April 2006

Hong Kong Science Park invests in German technology

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Thursday 6th April 2006

Lithography leaders receive 2006 Semicon Europa Award

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Wednesday 5th April 2006

International alliance of nanotechnology regions formed

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Tuesday 4th April 2006

AMD ships first product from fab 36

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Tuesday 4th April 2006

Oxford Instruments installs beta ALD system at Eindhoven University

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Sunday 2nd April 2006

Intel establishes $50 million venture capital fund for Brazil

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Saturday 1st April 2006

Surface Technology Systems wins £2 million pound MEMS order

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Friday 31st March 2006

Methode Electronics and SensorDynamics announce partnership

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Thursday 30th March 2006

Air products announce repositioning

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Wednesday 29th March 2006

Axcelis inaugrates Beijing technology centre

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Wednesday 29th March 2006

Multilateral agreement brings duties on multichips to zero

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Wednesday 29th March 2006

Applied Materials' etch system selected

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Wednesday 29th March 2006

De Clercq Engineering acquires Nimble

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Tuesday 28th March 2006

Micronic opens subsidiary in South Korea