Loading...
News Article

Brewer Science celebrates 10 years of collaborative research and development with JVIC

News

Brewer Science has celebrated the Jordan Valley Innovation Center's (JVIC) 10 years of collaborative research and development. Brewer Science, a major corporate partner of JVIC, joined members of the local business community; representatives from Missouri State University; and local, state, and federal representatives in celebrating this milestone.

"We are grateful for the opportunity to partner with the Jordan Valley Innovation Center and for everyone who has worked so hard to make this technology center possible," said Dr. Terry Brewer, founder and CEO of Brewer Science. "After 10 years of technological discovery, JVIC continues to grow and thrive. Our partnership with JVIC has resulted in technology breakthroughs that are changing the world around us. We look forward to the next 10 years of research and development across the I-44 corridor from Rolla to the heart of Springfield as Missouri continues to be a global technology leader."

Brewer Science is an integral partner at JVIC, developing new tech products, including its innovative sensor technology. JVIC is a state-of-the-art facility affiliated with Missouri State University and partners with technological leaders like Brewer Science.

Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.
New strategic collaboration between FRAMOS and NXP Semiconductors
Splitting hairs to ten to the power of four
TANAKA introduces “TK-SK” Palladium alloy for test equipment
Rebellions collaborates on next-gen AI computing chiplet technology
Semiconductor giants add $2.7 trillion to their stock values
Test early and test often
Semiconductors: Unstoppable growth in a billion-dollar market
Sustainable cleaning solutions for a greener microelectronics industry
Why the mask world is moving to curvilinear
Beyond AOI: An AI-driven revolution in visual inspection
Xscape Photonics raises $44 million Series A
CMOS sensors for niche vision applications
Emphasis on AI applications
Promoting collaboration and novel IC design technologies
East Asian manufacturer's metrology must-haves
Infineon intensifies sustainability collaboration
Accelerating semiconductor designs for AI applications
Heidelberg Instruments launches nanolithography tool
SEMIFIVE concludes HyperAccel contract
Nova Prism 2 selected by logic manufacturer
Baya Systems expands through partnership with IPro Silicon IP
SensiML and Efabless partner
How to bring photonic chips to the market faster?
Pfeiffer Vacuum becomes Pfeiffer Vacuum+Fab Solutions
Infineon combines silicon and silicon carbide in an e-mobility power module
Jacobs awarded CG Semi contract
Klika Tech joins Nordic Semiconductor Partner Program
Experts warn UK semiconductor firms are at risk from global trade war
Seoul Semiconductor illuminates its wired and wireless networking experience
Amkor and TSMC to expand partnership
Visualisation first for UC Santa Barbara
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: