Loading...
News Article

Western Digital and AMD Address Memory Scaling Demand for Fast-Growing In-Memory Computing Workloads

Western Digital announced the latest memory extension solution with AMD to meet the need of a growing number of customers to scale addressable memory sizes of existing servers for business-critical in-memory workloads such as real-time analytics. The combined solution of AMD EPYC processors with the Ultrastar DC ME200 Memory Extension Drive expands memory footprints at a higher memory-per-core ratio, in a scalable and cost-effective way.

Western Digital is exhibiting at RedisConf19, April 2-3, 2019 in San Francisco on Pier 27, Booth #19, and will showcase how the Ultrastar memory drives can help cloud architects and DevOps leverage memory drive technology in a variety of servers and industry-leading processors to scale Redis in-memory data sets for larger memory pools with lower TCO. The Redis community will also learn how they can optimize Redis data management and operations for containerized microservices, conduct Redis backups, deploy multi-cloud architectures, and build innovative applications for web-scale performance.

“For customers needing access to a broader memory footprint at a higher memory-per-core ratio, a server using AMD EPYC processors and Ultrastar memory drives can significantly scale addressable memory sizes of existing and new servers for in-memory applications and databases,” said Raghu Nambiar, CVP & CTO, datacenter ecosystems and application engineering, AMD. “This means that customers can achieve increased productivity with additional cost savings from greater addressable memory density, as well as reduced data center operations and resource consumption.”

Introduced in October 2018, the Ultrastar DC ME200 Memory Extension Drive is drop-in ready and PCIe-device compatible for scalable in-memory computing to address higher application performance needs and increasingly dynamic workloads and architectures. The latest version of the Ultrastar memory drive now supports AMD EPYC processors so cloud architects, DevOps leaders and digital platform managers can accommodate ever-growing data sets onto larger memory pools by augmenting DRAM without requiring changes to existing Linux® OS and application stacks.

The Ultrastar DC ME200 Memory Extension Drive improves the AMD EPYC processor-based server memory-to-core ratio compared to conventional scale-out DRAM compute clusters using only DIMMs. The memory expansion scalability of the Ultrastar memory drives also enables lower TCO of in-memory infrastructure through consolidation. For example, a cluster holding 30TiB of data in memory, using 30 nodes of 1TiB each, can be reduced to only eight nodes with 4TiB system memory each, with the added benefit of increased per-node CPU utilization.1 The Ultrastar memory drive is an ideal solution for in-memory database engines like SAP® HANA®, Oracle®, IBM®, and Microsoft®, as well as scale-out memory-centric architectures, such as, Redis, Memcached, Apache Spark™ and large-scale databases.

“AMD EPYC processor-based servers, combined with Ultrastar memory drives, can greatly increase the amount of overall memory per server to provide more cost-effective data center infrastructure for in-memory applications,” said Eyal Bek, vice president, data center and client computing devices at Western Digital. “We are deeply committed to working with partners like AMD to improve the ability of digital business customers to grow data sets without the imposing data center infrastructure costs.”

Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.
New strategic collaboration between FRAMOS and NXP Semiconductors
Splitting hairs to ten to the power of four
TANAKA introduces “TK-SK” Palladium alloy for test equipment
Rebellions collaborates on next-gen AI computing chiplet technology
Semiconductor giants add $2.7 trillion to their stock values
Test early and test often
Semiconductors: Unstoppable growth in a billion-dollar market
Sustainable cleaning solutions for a greener microelectronics industry
Why the mask world is moving to curvilinear
Beyond AOI: An AI-driven revolution in visual inspection
Xscape Photonics raises $44 million Series A
CMOS sensors for niche vision applications
Emphasis on AI applications
Promoting collaboration and novel IC design technologies
East Asian manufacturer's metrology must-haves
Infineon intensifies sustainability collaboration
Accelerating semiconductor designs for AI applications
Heidelberg Instruments launches nanolithography tool
SEMIFIVE concludes HyperAccel contract
Nova Prism 2 selected by logic manufacturer
Baya Systems expands through partnership with IPro Silicon IP
SensiML and Efabless partner
How to bring photonic chips to the market faster?
Pfeiffer Vacuum becomes Pfeiffer Vacuum+Fab Solutions
Infineon combines silicon and silicon carbide in an e-mobility power module
Jacobs awarded CG Semi contract
Klika Tech joins Nordic Semiconductor Partner Program
Experts warn UK semiconductor firms are at risk from global trade war
Seoul Semiconductor illuminates its wired and wireless networking experience
Amkor and TSMC to expand partnership
Visualisation first for UC Santa Barbara
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: