+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

RENA announce successful acquisition of US-based company MEI

News

Germany-based RENA Technologies GmbH has secured the strategic acquisition of MEI LLC headquartered in Albany, Oregon, to combine both companies’ individual strengths in the high-end semiconductor market. This investment follows the strategy to further diversify the wet-chemical surface treatment manufacturer’s product and service portfolio and approach the US semiconductor market.

With outstanding machine and process solutions for wet-chemical processing both RENA and MEI have complementary product portfolios and regional strengths to form a global player in the international semiconductor market.

RENA’s main markets are Europe and Asia while MEI has an established track record within the US high-tech semiconductor sector. Synergies can be found in the regional distribution of both companies’ customer base as well as their local service organizations, which allows them to offer a complete service portfolio. Together, the companies can cover all wetchemical process steps of semiconductor processing, from best-in-class prime wafer processing to state-of-the-art MEMS, SiC and semiconductor processing including Batch Immersion, Batch Spray, and Single-wafer applications.

“MEI’s and RENA’s product portfolios complement each other extremely well” said Peter

Schneidewind, CEO of RENA, “We strongly value the expertise of our new colleagues from MEI and are delighted to be able to offer our customers comprehensive solutions for semiconductor wet-processing equipment on a worldwide scale.”

“With a large number of orders in our backlog, we’re happy to join RENA Group, which provides us with a range of opportunities in regard to global market access and synergies in services, R&D, and production. This gives MEI the chance to advance to the next level globally,” added Ed Jean, CEO of MEI.

“We are absolutely convinced, that this combination brings superior value for our customers through an extended product portfolio and our joint global service team,” both CEOs summarized.

Biden-Harris Administration unveils preliminary terms with GlobalWafers
UK-India Technology Security Initiative launches in New Delhi
Chiplets increase performance and lower cost
Physik Instrumente opens Technology Hub in Southwest Germany
42 Technology partners with INFICON
Imec achieves record-low charge noise for Si MOS quantum dots
Infineon and Amkor sign MoU
Lattice extends Small FPGA portfolio
Nearfield Instruments secures €135 million in funding round
Experts urge EU to increase investment in photonics or risk falling behind China
Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: