The new European directives on lead-free electronic components might be a challenge for small companies to put into practice but the sooner they get to grips with the new rules, the better, writes Alpha Micro Components managing director Christos Papakyriacou.
Once mainly used in research, electron beam lithography is playing an increasingly important role in semiconductor fabrication, write Juergen Gramss, Ulf Weidenmueller and Ines Stolberg of Leica Microsystems Lithography.
A record-breaking new transmission electron microscope comes close to achieving the theoretical limit of image resolution, write Drs Peter Schlossmacher, Alexander Thesen and Gerd Benner of Carl Zeiss SMT.
Conventional chemical mechanical planarization techniques can cause problems at the 65nm device node. One promising alternative is electrochemical mechanical planarization. Alain Duboust, Yan Wang, Feng Liu and Wei-Yung Hsu of Applied Materials reports.
Lithography has been at the heart of the chip making process for more than three decades. But with the relentless demand for ever smaller feature size, has it reached its technological limit. David Ridsdale report.
Acoustic imaging provides a non-invasive method of scrutinising the innards of a computer chip. Sonoscan consultant Tom Adams explains the value of the technology in detecting potentially dangerous flaws in plastic ball grid array packages.
Indium phosphide wafer fab processes have traditionally lagged several years behind those used for silicon and gallium arsenide. But now the sector is beginning to catch-up, thanks to growing use of automation and better process control. Mike Syrett, director of Bookham's Caswell wafer fab operation, reports.
Aluminium Silicon Carbide's unique properties and low cost of fabrication make it the perfect material for thermal management heat spreading solutions for microprocessor and flip chip applications, write Mark Occhionero and Richard Adams of CPS Corp.
The microelectronics industry is constantly changing with new innovations introduced. Engineered substrates are been introduced to tackle issues of speed, power and leakage. Silicon-on-Insulator (SOI) has been one of the strong contenders. Dr. George Celler and Dr. Christophe Maleville of SOITEC discusses yield challenges and solutions for this emerging technology
Traditional silicon nitride deposition techniques are not suitable for sub-90nm devices because of the need for low thermal budgets. We report on a new low temperature silicon nitride deposition method developed by Aviza Technology in association with Air Liquide Electronics.
Ever told someone your password for your work computer? If so, you could be suffering from Password Overload Syndrome, a worrying disorder that leaves companies' computer systems wide open to security breaches. Cyber-Ark senior consultant Calum MacLeod thinks he's found a cure.
Researchers in Belgium have developed an easy-to-use and make magnetic transporting device that paves the way for new biosensor applications. Els Parton, Roel Wirix-Speetjens and Gustaaf Borghs of IMEC report.