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Friday 1st April 2005
A breakthrough in silicon-based lasers could pave the way for lightning fast communications devices and innovative medical applications. European Semiconductor Magazine takes a look.
Friday 1st April 2005
A new type of semiconductor parameter analyser will be needed to meet the needs of the industry at the 65nm and 45nm nodes, write Alan Wadsworth and Tomoyuki Akiyama of Agilent Technologies.
Thursday 24th March 2005
IBM has developed a new strained germanium technology that can increase the speed of transistors threefold without the hassle of having to scale them down. Huiling Shang of IBM Research reports.
Thursday 24th March 2005
The move towards lead-free electronic devices has thrown up a number of challenges for package designers and manufacturers. George Carson and Michael Todd of Henkel Corp take a look.
Thursday 24th March 2005
The new European directives on lead-free electronic components might be a challenge for small companies to put into practice but the sooner they get to grips with the new rules, the better, writes Alpha Micro Components managing director Christos Papakyriacou.
Thursday 24th March 2005
Copper will increasingly replace aluminium as semiconductor companies continue to scale down feature sizes. Dave Cavanaugh and Joanne Itow of research body Semico's manufacturing group explain why.
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Thursday 24th March 2005
Once mainly used in research, electron beam lithography is playing an increasingly important role in semiconductor fabrication, write Juergen Gramss, Ulf Weidenmueller and Ines Stolberg of Leica Microsystems Lithography.
Thursday 24th March 2005
Modelling software has proved invaluable in one semiconductor company's bid to develop a faster and cheaper method for depositing copper contacts on flip-chip carrier substrates.
Thursday 24th March 2005
The future of packaging was the theme of a recent symposium held in Japan. European Semiconductor Magazine reviews some of the key points to emerge from the event.
Thursday 24th March 2005
No matter what the rules may be throughout other domains, in the Silicon Zoo, size does matter!
Thursday 24th March 2005
A record-breaking new transmission electron microscope comes close to achieving the theoretical limit of image resolution, write Drs Peter Schlossmacher, Alexander Thesen and Gerd Benner of Carl Zeiss SMT.
Tuesday 1st March 2005
Conventional chemical mechanical planarization techniques can cause problems at the 65nm device node. One promising alternative is electrochemical mechanical planarization. Alain Duboust, Yan Wang, Feng Liu and Wei-Yung Hsu of Applied Materials reports.
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Tuesday 1st March 2005
An ingenious new CMOS-compatible process promises to significantly improve the performance of power devices. F Udrea, T Trajkovic and GAJ Amaratunga of Cambridge Semiconductor report.
Tuesday 1st March 2005
Lithography has been at the heart of the chip making process for more than three decades. But with the relentless demand for ever smaller feature size, has it reached its technological limit. David Ridsdale report.
Tuesday 1st March 2005
Nanoimprint lithography is being touted as a promising technology for the 32nm node. Thomas Glinsner and Helge Luesebrink of the EV Group report on this promising new technique.
Tuesday 1st February 2005
Acoustic imaging provides a non-invasive method of scrutinising the innards of a computer chip. Sonoscan consultant Tom Adams explains the value of the technology in detecting potentially dangerous flaws in plastic ball grid array packages.
Tuesday 1st February 2005
Indium phosphide wafer fab processes have traditionally lagged several years behind those used for silicon and gallium arsenide. But now the sector is beginning to catch-up, thanks to growing use of automation and better process control. Mike Syrett, director of Bookham's Caswell wafer fab operation, reports.
Tuesday 1st February 2005
Aluminium Silicon Carbide's unique properties and low cost of fabrication make it the perfect material for thermal management heat spreading solutions for microprocessor and flip chip applications, write Mark Occhionero and Richard Adams of CPS Corp.
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Tuesday 1st February 2005
The microelectronics industry is constantly changing with new innovations introduced. Engineered substrates are been introduced to tackle issues of speed, power and leakage. Silicon-on-Insulator (SOI) has been one of the strong contenders. Dr. George Celler and Dr. Christophe Maleville of SOITEC discusses yield challenges and solutions for this emerging technology
Tuesday 1st February 2005
Traditional silicon nitride deposition techniques are not suitable for sub-90nm devices because of the need for low thermal budgets. We report on a new low temperature silicon nitride deposition method developed by Aviza Technology in association with Air Liquide Electronics.
Tuesday 1st February 2005
Ever told someone your password for your work computer? If so, you could be suffering from Password Overload Syndrome, a worrying disorder that leaves companies' computer systems wide open to security breaches. Cyber-Ark senior consultant Calum MacLeod thinks he's found a cure.
Wednesday 1st December 2004
Copper's share of the bonding wire market is set to grow rapidly over coming years, writes Hans Martin Buschbeck, product marketing manager of Kulicke & Soffa Industries.
Wednesday 1st December 2004
The challenges of working at the nano level require a new approach to process research and development, writes Dr Mark Pinto of semiconductor equipment giant Applied Materials.
Wednesday 1st December 2004
Researchers in Belgium have developed an easy-to-use and make magnetic transporting device that paves the way for new biosensor applications. Els Parton, Roel Wirix-Speetjens and Gustaaf Borghs of IMEC report.
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