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Thursday 1st December 2005
Over the past two years, a tsunami called design for manufacturing (DFM) has engulfed the semiconductor industry. Anyone attending the most recent Design Automation Conference (DAC) couldn't avoid DFM in booths, papers, panels and presentations. And who would have thought we'd see Applied Materials at DAC and Synopsys at Semicon West last July, talking about the same subject? Ken Rygler, CTO and President of Rygler and Associates discusses.
Thursday 1st December 2005
The smaller devices become the more complex the engineering to manufacture and test. Paul Meyer, Product Marketer at Keithley Instruments discusses how industry challenges are being met to ensure test reliability below 90nm manufacturing.
Tuesday 1st November 2005
New product safety regulations came into force in the United Kingdom on 1 October 2005 and have already been implemented in most EU states. With several new powers and criminal sanctions available to the authorities, product safety is likely to come under increasing public scrutiny throughout Europe. Nick Marsh is a solicitor in the law firm DLA Piper Rudnick Gray Cary UK LLP's litigation group and answers some frequently asked questions on the new regulations.
Tuesday 1st November 2005
Manfred Besold of Aerotech discusses how throughput can be improved by the introduction of a direct drive system that is purpose built for the company's needs and discusses the money saved by doing it right from the start.
Tuesday 1st November 2005
With every fractional change in a fab, yields are affected. A Fab Manager's day can easily be taken up in attempts to ensure a tool operates within the parameters required to enable the highest of yields. Effective Cost of Ownership (CoO) is an expectation from fabs today. Bruce Fries, Director of DC Systems at Advanced Energy Industries argues that awareness of CoO will always reveal the best from competing options.
Tuesday 1st November 2005
Will European legislation enforce compliance for lead free electronics? Definitely so for the electronics industry and electrical equipment manufacturers. Soon to take effect and set the standard is the European RoHS regulation that arrives with the prospects of a newer, healthier, shinier industry which will make a greater greener difference. Michelle Winny of European Semiconductor looks at the ins and outs of what all the electronics manufacturers and suppliers are talking about or should be. Has your company begun thinking about an integration plan?
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Tuesday 1st November 2005
While the world is arguing over the "nickel tag," a passive RFID tag priced at 5 US cents, and whether it could be on the market by 2008, the suppliers of backend equipment are aggressively pursuing various technology avenues that would decrease manufacturing costs for ubiquitous RFID tags. Hugo Pristauz, Manager, Advanced Technology & Business Development RFID at Datacon discusses the successful efforts.
Tuesday 1st November 2005
Using product in Die form has been around for many years now. Over time the driving factors for using Bare Die have changed allowing their use in many more applications. Graham Neil, Global Die Business Developments Manager for International Rectifier explores the motivations and business needs for using product in Bare die form, some of the challenges faced by users and suppliers alike and asks the question if Bare Die solutions have really come of age?
Saturday 1st October 2005
Next generation front-end wafer cleaning technologies are an enabling technology for sub-100nm chip manufacturing. Frost and Sullivan report on a recent assessment the team carried out.
Saturday 1st October 2005
This paper examines the different options for wafer thinning, identifies the implications of each method and explores specifics of the preferred method. By Wolfgang J. Sievert, Kurt-Uwe Zimmermann, Honeywell Electronic Materials, BSEC-TSD Lab, Seelze - Germany and John S. Starzynski, Honeywell Electronic Materials, Honeywell Labs, Plymouth, MN, USA
Saturday 1st October 2005
The semiconductor industry is almost grown-up. Slowing revenue growth and problems with the continuance of ‘Moore's Law' are threatening familiar characteristics of the industry. We have analysed emerging changes in the relationship between chip manufacturers and their equipment suppliers. Longer term, we expect a continued reduction in the capital intensity of the industry, which would be positive for the cash flow of chip manufacturers but would limit growth prospects for equipment suppliers. A look at R&D intensity reveals a shift in innovation power from equipment suppliers to chip manufacturers. By Dr. Karsten Iltgen, Semiconductor Analyst at WestLB.
Saturday 1st October 2005
When developing new equipment for semiconductor manufacture, it's rarely a good idea to yield to the temptation of designing linear motion control systems in house. Phillip Wallington of Anorad discusses.
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Saturday 1st October 2005
Simon Hicks, of Intellevation Ltd, discusses how the application of unique patented shape recognition algorithms and the use of process simulation to the in-situ optical monitoring of high precision vacuum-based fabrication processes is increasing yield and product performance whilst significantly decreasing development time and ultimately decreasing manufacturing costs. By Dr Simon E Hicks, CEO, Intellevation Ltd.
Saturday 1st October 2005
Wafer cleaning represents up to 15% of the total process steps to build an advanced, 90-nm semiconductor device and is still mainly carried out in batch processes. Performance and throughput advantages are the main reasons for the persistence of batch processing in cleaning. However, concerns about cycle time are driving development of single wafer cleaning processes. Jeffery W. Butterbaugh of FSI International looks at alternatives for maintaining performance and throughput while realizing gains in productivity for cleaning processes.
Thursday 1st September 2005
Metrology is a necessary, but time and space consuming part of the production process. implementation of adaptive sampling allows factory managers to look at metrology tools in the same manner as other limited resources in the factory. AMD Automated Process Control technology development manager Matthew Purdy maintains that metrology capacity should be dynamically matched to critical information needs.
Thursday 1st September 2005
Semiconductor factories have always been a large consumer of electrical energy and there is an on-going introspective examination by many device makers to reduce energy consumption as part of their global environmental policies. The ITRS calls for a 20 to 40% reduction in energy consumption by fab tools in the near term. Dominic Potter from SMC Corporation, Phil Naughton (Freescale Semiconductor assignee at SEMATECH) and Carlos Lee from SEMI report.
Thursday 1st September 2005
Given the challenges for 65nm interconnect scaling, choice of process architecture is a key determinant of performance, reliability, and extendibility. Freescale Semiconductor's Robert Fox describes a robust, proven trench first hard mask (TFHM) integration, including the performance and yield benefits.
Thursday 1st September 2005
The International Technology Roadmap for Semiconductors (ITRS) has adopted nanoimprint lithography (NIL) as a contending Next Generation Lithography (NGL) for technology nodes ²32nm. Standards will be required to support the commercialization. Helge Luesebrink from EV Group and Carlos Lee from SEMI report.
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Thursday 1st September 2005
The 2005 Eurosemi IC Industry Awards have been decide. The event became a hard fought battle for some and a clear indicator of customer relations for others. Editor in Chief David Ridsdale looks at the process.
Monday 1st August 2005
A new stress-free polishing process has been developed that eliminates the need to remove interconnect barrier layers and provides good protection of underlying low-k films. Dr David Wang, founder and CEO of ACM Research, reports.
Monday 1st August 2005
Real-time fault detection and classification is one of the holy grails of semiconductor manufacturing. John Scanlan, Kevin O'Leary, Marcus Carbery, Francisco Martinez and Paul Scullin of Straatum report.
Monday 1st August 2005
A technique commonly used in surface-mount-technology could prove highly effective in forming the interconnects for advanced semiconductor packaging. DEK president Richard Heimsch discusses mass imaging for wafer bumping.
Monday 1st August 2005
The need for known quality die in system-in-packages is placing new demands on automated test equipment. Peter O'Neill and Tom Vana of Agilent Technologies explain how new testing approaches can weed out unreliable devices without pushing up prices.
Monday 1st August 2005
Power handling is a pervasive area of the semiconductor industry with power devices present in every day products such as PCs, PDAs, cars, handsets and white goods. According to iSuppli, the power management market grew 24% to $20 Billion in 2004, faster than the total semiconductor market, and is forecast to continue to grow at a Compound Annual Growth Rate of 12.7% through 2008. By Dave Thomas, Etch Product Marketing Manager at Trikon Technologies.
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