Integrated circuit devices continue to shrink in size, increase in density, and improve in performance every year. Manufacturing and testing these devices while simultaneously maintaining and improving yield has become increasingly difficult. David Ridsdale spoke to Dr. Stewart Wilson, European System Sales Manager for Parametric Test Systems at Agilent about the growing need for parametric testing in the industry.
Update and preview Behind the scenes IMEC has been busy developing the latest in a line of collaborative efforts. Delivering its up to date autumn offerings IMEC announces the prospects of what can be achieved when industry leaders join forces.
Regenerate and reuse Wafer recycling offers a huge effective method for cost saving. Alex Zhang, Semiconductor Manufacturing International Corporation, Fab 4C Jack Kao1, Tony Pei1 Hao Liu, Helen Qian, Leo Archer of SEZ discuss the possibilities
New methods through old convention Transmitting digital data through analogue technology inevitably will lead to loss in data transferral, however with the use of high speed interfacing a recovery of lost bits can help to retrieve and realign the stray information. Jeff Waters, Product line Director, National Semiconductor discusses the solution for data loss in its multiplexer family.
Electronic power systems Design environments that allow all functional aspects to maximise operational performance, Dr. Marcian Cirstea of IEEE talks electronic SoC’s from an integrated modelling and design approach.
Measurement of dielectric constant presents the semiconductor industry with many challenges. Problems can often be related to the unique properties of the low k material in question. Liam Cunnane, Adrian Kiermasz PhD, Rob Wilby of Metryx Ltd, & Youssef Travaly of IMEC discuss the issues ranging from interface charge to modification of the film by the measurement technique. Demonstrated in the relationship between the density of a Low k material and its Dielectric Constant, is a robust and cost effective method of monitoring product non-destructively.
quick cycle long spinMinimizing on cycle lengths can have a dramatic effect on market share when bringing new IC’s to market. J. Blanc and S. Hury of INCAM Solutions France discuss how queue jumping may be the clue to achieving shorter cycle times by conveying rush lots in single wafer carriers.
Ending with the beginningBack end technology must reflect ingenuity in the design of its console. Andy Longford of P&A Europe discusses why chip design housing must be the chicken that came before the egg where it proves prudent to consider chip packaging right at the stages of chip design.
Hearing out the problems Could acoustic microscopy be the answer to perfecting microelectronic device manufacturing? Tom Adams of Sonoscan discusses the effects of using acoustic microscopy to bounce back a sound understanding of what goes on beneath the chips surface
Head in the sand won’t work The RoHS directive caused stir enough alone but now there is no escape for those hoping to avoid hefty legislation enforcement as two new laws loom overhead for the electronics industry Michael Kirschner, President, Design Chain discusses the implications.
As next generation MEMS become increasingly sophisticated, refined handling strategies are necessary to facilitate the growing intricacy of the technologise employed. Multitest discussess its latest test platform for performance test calibration for automotive MEMS production.
Guaging MEMS under operational conditions, Dr. Carol Daniel of Lambda Photometrics explores the concepts behind Scanning White Light Interferometry for the measurement of MEMS under static and dynamic operating conditions.
Surplus semiconductor snafu!Rising inventory stockpiles in semiconductor supplies have given cause for concern in the past, however now the industry raises an eyebrow at Intel as the culprit for this current inventory glut. Find out why the global electronics industry on the whole is not worried about inventory excess as iSuppli’s latest semiconductor industry report dispels any inventory angst.
Electronic Security Recently launched WISDOM project funded by the EU will develop a re-configurable photonic ‘firewall on a chip.’ Find out how this development will compliment current electronic security techniques in optical information filtering with hybrid integrated photonic technology.
Reliability and Performance Device functionality is always at the forefront of leading edge device design. Effective design alteration as a result can have profound effects on the outcome of product performance, when diffusion barriers are inserted to reduce hard mask nitride induced mechanical stress the interfacial contact resistance proves lower than with conventional poly-Si gate stack. Researchers at Hynix report on reduced contact resistance.
Inventory Management Compliance with the RoHS directive must now be fully implemented. To accommodate the recently enforced demands of this directive Bookham have developed a certification process used to effect RoHS transition to assure ongoing conformance Alan Hughes, Kevin Prowse, Karen Whicker, Nick Watt and Reiner Brue of Bookham discuss.
Aquisition Merger Diversifying the marketing mix. AMD announces its latest move to purchase ATI Taiwan but not all analysts stood up to commend the decision. So just what are the implications of this take over for AMD’s technology in microprocessing and ATI”s business in graphics chipsets? Find out the news on this latest industry development.
Well Penned Thoughts Industry experts have cast their predictions at the commence of each yearly cycle. But for analysts like Malcom Penn, when the mood changes and the predictions turn a different course how should the industry react especially when the focus is steered away from expectation. What does the change in Penn’s recent forecast mean for the industry for ensuing months?
Don’t count on it! When multiple electromigration failure modes exhibit bimodality it may be time to question void formation. Shou-Chung Lee and Anthony S. Oates of TSMC report on the findings of electromigration-induced void morphologies.
Compliance Testing Effective RoHs legislation. With Compliance in demand from all links in the electonics industry chain all must respond with immediacy. Joanna Symons of Soldertec Global discusses the advantages of a new service aimed at compliance investigation in response to this recent industry enforcement.
Pushing the boundaries of process linearity to extremes and the subsequent need for new specification etch tools to exceed these parameters, Dr Chris Constantine, Chief Technical Officer, Unaxis USA, INC discusses.