News Article
SUSS, IBM collaborate on Advanced Packaging and 3D Integration
SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor industry and related markets, has announced the extension of a joint development agreement (JDA) with the IBM Corporation.
SUSS MicroTec Photonic Systems Inc, a subsidiary of SUSS MicroTec, recently installed an ELP300 Excimer laser stepper system at IBM. The installation of the Excimer laser system, and the JDA extension under this alliance, will serve to further develop, enhance and propel the application of Excimer laser technologies in the realm of advanced semiconductor packaging "“ including 3D systems integration.
SUSS say the Excimer laser process offers extended process capability beyond traditional manufacturing approaches.
In the program, IBM and SUSS MicroTec will continue collaboration on the development of Excimer laser processes and process systems for two distinct roles; Seed Layer Removal for UBM (under bump metallization) and micro-structuring organic dielectrics (Vias and RDL trenches) for system interconnects.
"We see high growth potential for this technology and continue contributing to the development of alternative manufacturing processes that address existing manufacturing challenges and continued cost reductions." says Frank P. Averdung, President and CEO of SUSS MicroTec. "Together with IBM, we intend to extend these capabilities to meet industry needs."
