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News Article

AMAT to host forum to discuss the future of 3D NAND


The event will take place in Washington, D.C. on Tuesday, December 10th, 2013

Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

The resulting reliability, density, performance, and power savings benefits will continue to drive this vertical NAND transition. On December 10th, 2013, Applied Materials, Inc. will host an important forum in Washington D.C. for a thought-provoking examination of the growing momentum in 3D NAND from device, system, and user perspectives.

The forum will take place at the Omni Shoreham Hotel,2500 Calvert Street NW, Washington, D.C.

3D NAND is clearly here to stay with leading-edge memory chipmakers focusing significant resources on this segment. But while 3D NAND promises substantial benefits in easing key planar scaling limitations, several questions remain regarding the future of this technology.

How far can it be scaled? What issues will affect its scaling? Which applications will use it first? Will 3D NAND continue lowering the cost per bit? What technologies will follow?

Applied Materials and guest panelists from several industry leaders will provide insight on these critical issues in a panel titled "3D NAND Is a Reality - What's Next?"

You canregister for this event, at the website www.appliedmaterials.com/NAND-panel.

The moderator of the event will be Gill Lee, senior director, principal member of technical staff, Silicon Systems Group, Applied Materials.

The panel includes the following semiconductor industry veterans.

Ritu Shrivastava, Ph.D. - vice president, technology development, SanDisk Corporation

Chuck Dennison - senior director, process integration, Micron Technology, Inc.

Seok-Kiu Lee - vice president, head of flash device technology group, R&D division, SK hynix Inc.

Hang-Ting Lue, Ph.D. - deputy director, Nanotechnology R&D division, Macronix International Co., Ltd.

Bradley Howard, Ph.D. - vice president, advanced technology group, Etch, Applied Materials, Inc.

Where:  Omni Shoreham Hotel,2500 Calvert Street NW, Washington, D.C.

Schedule:

            5:00 - 6:00pm        Shuttle from Hilton Washington Hotel

            5:00 - 6:15pm        Registration and Reception

            6:15 - 7:30pm        Panel Discussion

            7:30pm                  Return shuttle to Hilton Washington Hotel

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