Shanghai-based BCD Semiconductor Manufacturing Ltd has filed for an initial public offering (IPO) with U.S. regulators and plans to offer 6 million American depositary shares in the range of US$9 to US$11 each.
Researchers in Rensselaer's Department of Physics and Center for Integrated Electronics have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging. Along with allowing enhanced performance and cost savings for conventional photolithography processes, the new material, called polyset epoxy siloxane (PES), should also enable a new generation of lower-cost, on-chip nanoimprinting lithography technology, according to the researchers.
European industry analyst, Future Horizon's expects double digit growth for the semiconductor industry as long as the global economy can hold together. The annual industry forecast seminar in London was told to expect 10% growth in unit and 12% growth in dollar terms, reversing the recent trend of units growing faster than price.
Powerchip Semiconductor Corporation (PSC), a Taiwan-based memory semiconductor supplier offering Dynamic Random Access Memory chips (DRAMs) and Flash memory chips, has entered into a partnership with IMEC, Europe's leading independent nanoelectronics research center, to perform research and development for the sub-32nm memory process generations.
Mems Technology Berhad (Memstech) released a statement by K. Sooriakumar, CEO of Memstech, in response to a patent infringement investigation initiated by the International Trade Commission (ITC) at the request of Knowles Electronics LLC (Knowles).
Mass metrology company, Metryx, Limited, announced the receipt of a multiple system follow-on order from Taiwanese semiconductor memory manufacturer, Inotera Memories. The order is for Metryx' Mentor DF3 platform and will be used initially to monitor etch applications.
The Naughton Institute, a €100 million state-of-the-art new science facility at Trinity College Dublin which will house Ireland's first purpose-built nanoscience research institute, the Centre for Research on Adaptive Nanostructures and Nanodevices (CRANN) and the world's first Science Gallery was officially opened by the Taoiseach, Bertie Ahern TD.
Savi Technology, a Lockheed Martin company and India-based AVAANA have entered into partnership for active Radio Frequency Identification (RFID)-based supply chain solutions, products and services to prospective government and commercial customers in India.
Panasonic announced that the company will build a new factory (second building) to facilitate the business expansion of Panasonic Semiconductor (Suzhou), The company held a ceremony at the site that was attended by government officials from the City of Suzhou.
National Semiconductor Corporation announced that it is disposing of certain manufacturing equipment and reducing staff at its wafer fabrication facilities as the company continues to take steps to modernize facilities and rationalize its capacity.
Rudolph Technologies, a provider of process characterisation equipment and software used in wafer processing and semiconductor final manufacturing facilities announced that it has acquired all intellectual property and selected assets from privately held RVSI Inspection.
Two leading centers for next-generation nanoelectronics research and development - the College of Nanoscale Science and Engineering ("CNSE") of the University at Albany in Albany, NY and IMEC in Leuven, Belgium - announced plans to jointly perform extreme ultraviolet lithography ("EUVL") experiments in order to accelerate the introduction of EUVL into manufacturing.
The Medipix2 chip is a photon counting X-ray detector, developed by the Medipix Collaboration. This project involves CERN (European Organization for Nuclear Research) and PANalytical as well as other research institutes including Nikhef, the National institute for subatomic physics in the Netherlands.
austriamicrosystems, a designer and manufacturer of analog ICs for communications, industry, medical and automotive applications, and New Scale Technologies, Inc., a developer and manufacturer of miniature motion systems, announced the completion of a Series B preferred equity transaction.
Fujitsu Limited announced its decision to pursue the reorganisation of its LSI business divisions into a new subsidiary scheduled to be established within March 2008. The decision was approved at a Board of Directors meeting, based on careful consideration that Fujitsu had given this matter over a significant period of time.
FEI Company has opened a NanoPort facility in Shanghai, China. The new facility is the fourth such location joining those already in operation in North America, Europe and Japan. FEI NanoPorts provide centres of technical and applications excellence focusing on collaboration with researchers and developers.
Researchers from a number of Universities based at Rice University in Texas have announced the use of carbon nanotubes to create a material that absorbs 99.9 percent of light. The material is almost 30 times darker than a carbon substance that is the current benchmark of blackness.
Braggone, an optoelectronics materials company, has signed a joint development agreement with equipment supplier Beneq to offer a turnkey solution to provide a custom matched material and toolset for manufacturing solar cells.
EV Group (EVG), a supplier of manufacturing equipment, announced that it has received a multi million Euro order from a European plastic electronics manufacturer for high volume production of flexible displays.
Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-inch) production line in Austin, Texas, complementing the existing 150-mm (6-inch) MEMS capacity in Sendai, Japan.