+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

STMicroelectronics reveals smallest MEMS eCompass chip

News

The tiny 2mm x 2mm precision orientation sensor combo enhances freedom to optimise system performance and create smaller form factors in products such as smartphones



STMicroelectronics has leveraged its investment in advanced MEMS technology to create what it says is the world's smallest eCompass.

The device combines a 3-axis accelerometer and 3-axis magnetometer (magnetic field sensor) in a single package.

Measuring just 2mm x 2mm, the compact chip, used for advanced navigation and motion-sensitive features in products such as smartphones, is nearly 20 percent smaller than similar devices.

Even the smallest space savings can be precious inside a smartphone, activity-monitoring bracelet or smart watch. ST claims its new LSM303C eCompass saves almost 1mm2 of pc-board space compared to the closest competing device.

This helps designers to optimise their component layout and minimise Wi-Fi, Bluetooth and cellular radio interference and improve the performance of applications like indoor navigation or advanced motion tracking.

For other smart consumer and professional applications, including wearable devices, the LSM303C's size advantage enables smaller form factors. What's more, the package of this combined accelerometer and magnetometer is board-compatible with ST's 12-lead pure-accelerometer devices, allowing designers to quickly enhance or upgrade the features of more basic products.

The LSM303C provides an accurate orientation signal at its 16-bit digital output. With a full-scale magnetic-field strength range of +/-16 Gauss or +/-1600 microTesla (µT), the magnetic-field sensor has a wider dynamic range than alternative devices.

The accelerometer has selectable full-scale range of +/-2, +/-4 or +/-8g, and combines high resolution with state-of-the-art output accuracy.

The LSM303C also has advanced power management, thermal compensation, a wide analogue supply-voltage range, and programmable interrupt generators for movement, free-fall and magnetic-field detection.

These properties help streamline system design. The low noise level and low power consumption of the LSM303C also help simplify software design by allowing motion applications to operate continuously.

The LSM303C can be combined with a discrete miniature gyroscope from ST's large MEMS portfolio, such as the 3mm x 3mm L3GD20H, to achieve 9-axis sensing in equipment such as high-end smartphones, gaming controllers or sports monitors.

ST's sensor portfolio comprises discrete accelerometers, magnetic-field sensors and gyroscopes, digital compasses such as the new LSM303C, integrated inertial modules with 6 or 9 degrees of freedom, ARM-based smart sensors, the iNEMO Engine sensor-fusion software suite, and the iNEMO-M1 small form-factor system on board.

"As the world's smallest eCompass, the LSM303C is ideal for use in all smartphones and innovative context-sensitive devices used throughout the home, workplace, wellness and leisure activities. Moreover, when used together with our MEMS gyroscopes, it can support even more advanced movement and position-related functionality," says Fabio Pasolini, General Manager, Motion MEMS Division, STMicroelectronics. "This tiny new sensor extends our MEMS portfolio, which continues to maintain its industry-leading position based on early and sustained investment in the technology."

ST is sampling the LSM303C now, and will begin mass producing devices in the 2mm x 2mm x 1mm LGA package in December 2013. Pricing will start at $1.10 for orders over 1,000 pieces.

According to IHS' "MEMS H2 2012" special report, STMicroelectronics is the world's top MEMS manufacturer, and the leading supplier of MEMS devices for consumer and mobile applications.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: