STATS ChipPAC awards its top suppliers
STATS ChipPAC Ltd. has announced the recipients of its sixth annual Supplier Awards, honouring the company's top suppliers in recognition of their excellent performance and outstanding support in 2012.
The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovation for STATS ChipPAC and its customers. Supplier partnerships are evaluated on multiple criteria including technology, quality, delivery, responsiveness, service and cost competiveness.
Six companies received STATS ChipPAC's top honour, "Best Supplier Award", for overall best-in-class performance in cost, quality, delivery, technology, service and support.
Nine companies were recognised with "Outstanding Award in Service and Support" for overall excellent performance, service and support. There were six companies that were recognised with "Outstanding Site Award in Service and Support" for their significant impact on a particular STATS ChipPAC manufacturing site. The winners by category are:
Best Supplier Award : Advantest Corporation, Daewon SPIC/Peak International, Duksan Hi-Metal Co., Ltd., Kinsus Interconnect Technology Corporation, Kulicke & Soffa Industries, Inc., NAMICS Corporation.
Outstanding Award in Service and Support: BE Semiconductor Industries N.V., EO Technics Co., Ltd., Lam Research Corporation, Mitsui High-tec Inc., MK Electron Co., Ltd., Nagase & Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Teradyne, Inc., UBoT Incorporated Limited.
Outstanding Site Award in Service and Support: FedEx Express (for STATS ChipPAC Singapore/ STATS ChipPAC Malaysia), Henkel Adhesive Technologies - Electronics (for STATS ChipPAC Korea), Hon. Technologies, Inc (for STATS ChipPAC Shanghai), Oriental Mercury International Cargo Transportation Co., Ltd. (for STATS ChipPAC Shanghai), Simmtech Co., Ltd. (for STATS ChipPAC Singapore), Tanaka Kikinzoku International K.K. (for STATS ChipPAC Singapore),
"Our partnership with our suppliers worldwide plays an integral role in enabling STATS ChipPAC to deliver the highest level of quality and service for our customers. We are pleased to honour our award recipients who have demonstrated outstanding commitment and performance in providing STATS ChipPAC and our customers with the best value, innovation, highest quality products and services," says Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC. "We congratulate all of our top suppliers for their achievements."
STATS ChipPAC Ltd. is a service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing.
